Electronic Component Housing Terminal Bonding Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic component housing containers face issues with bonding wire attachment, where transverse forces can dislodge pin terminals, compromising airtightness due to moments acting on brazed portions.
Innovation Solution
The container design incorporates a pin terminal with a flange portion and a ring-like member, where the flange is bonded to the insulation member, and the ring-like member is bonded to the opposite side, enhancing bonding strength and airtightness, while allowing for thermal expansion gaps to prevent stress-induced cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pin terminals are brazed to the flat plate for signal input-output, then electrical connection is achieved, but the airtightness is impaired due to moments acting on the brazed portion when bonding wires are attached
Solution Approach 1:
The input-output terminal is divided into two separate functional parts: a flat plate for hermetic sealing (bonded to the frame body) and a pin terminal for electrical connection. This segmentation allows the flat plate to maintain airtightness while the pin terminal handles electrical signals, eliminating the conflict between sealing and electrical connection functions.
Solution Approach 2:
The flat plate acts as an intermediary component between the frame body and the pin terminal. It provides a hermetically sealed mounting surface for the pin terminal while isolating the brazed joint from mechanical stresses caused by wire bonding, thus protecting the airtightness of the container.
2Ease of operation
If pin terminals are mounted through the frame body for electrical connection, then signal input-output function is achieved, but transverse forces during wire bonding dislodge the pin terminals
Solution Approach 1:
The terminal structure is segmented into a flat plate for mechanical support and hermetic sealing, and a pin terminal for electrical connection. The pin terminal is mounted only on the flat plate rather than through the entire frame body, reducing the lever arm and moment effects that cause dislodgement during wire bonding.
Solution Approach 2:
Instead of mounting the pin terminal directly through the frame body (conventional approach), the invention inverts the mounting strategy by first providing a separate flat plate that is hermetically bonded to the frame body, then mounting the pin terminal on this plate. This reverses the sequence and location of mounting, improving mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design increases the reliability of the electronic component housing container's airtightness, prevents stress from thermal expansion, and allows for downsizing by eliminating the need for additional space for the ring-like member, while maintaining high production efficiency and hermetic sealing.
Implementation Method 1
The frame body 102 is bonded to an upper main surface of the base 101 with a brazing material such as a silver (Ag) solder
Implementation Method 2
a moment acts on a portion of the pin terminal 104 brazed to the flat plate 103a
Implementation Method 3
the flange portion and the ring-like member are less prone to separate from the insulation member because the ring-like member is bonded to the opposite side of the insulation member where the flange portion is bonded
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3~4
AI summary
An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate (1) and a side wall (2) which surrounds a center region of the bottom plate (1), and an input-output terminal (3). The input-output terminal (3) includes an insulation member (5), a pin terminal (4), and a ring-like member (6). The insulation member (5) is bonded to a periphery of an opening of a through hole (2a) provided in the side wall (2) so as to close the through hole (2a). The pin terminal (4) has a flange portion (4a) protruding from an outer peripheral surface of the pin terminal, and is pierced through the insulation member (5), and the flange portion (4a) is bonded to the insulation member (5). The ring-like member (6), through which the pin terminal (4) passes, is bonded to the outer peripheral surface of the pin terminal (4) and to the insulation member (5), on an opposite side to a surface of the insulation member (4) to which the flange portion (4a) is bonded. Problems arising in the bonding portion of the insulation member (5) due to a force applied to the tip of the pin terminal (4) are alleviated.