Electronic Device Housing Ventilation Wall Design
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Solution Overview
Problem
Electronic devices with resin housing bodies face cooling issues due to restricted ventilation when peripheral devices cover vent holes, leading to high internal temperatures from heat generation.
Innovation Solution
A surrounding wall part is provided on the outer surface of the housing body to create a ventilation region, ensuring airflow through vent holes even when peripheral devices are attached, using protruding ends to maintain open channels for air exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If vent holes are formed on the outer surface of the main housing body to enable ventilation, then cooling performance is improved, but when peripheral devices are installed to cover part of the vent holes, ventilation is restricted and internal temperature increases
Solution Approach 1:
The housing body is divided into multiple surfaces, with vent holes distributed across different surfaces. This segmentation ensures that even if peripheral devices cover vent holes on one surface, other surfaces maintain ventilation pathways, preventing complete blockage of cooling airflow.
Solution Approach 2:
Different surfaces of the housing body are equipped with vent holes at strategically chosen locations where peripheral devices are less likely to obstruct them. This local optimization ensures that critical ventilation pathways remain open regardless of peripheral device installation.
2Adaptability or versatility
If peripheral devices are installed around the electronic device to cover part of the extensional region of vent holes, then device integration is improved, but ventilation through vent holes is restricted
Solution Approach 1:
Vent holes are distributed across multiple surfaces (different spatial dimensions) of the housing body rather than concentrating them on a single surface. This multi-dimensional arrangement ensures that peripheral devices covering one area do not block all ventilation pathways, maintaining cooling reliability while allowing device integration.
3Ease of manufacture
If resin is used as material of main housing body to reduce cost, then manufacturing cost is reduced, but thermal conductivity is lower than metal
Solution Approach 1:
The heat dissipation function is extracted from the housing body material itself and transferred to a dedicated ventilation system. By creating multiple vent holes across different surfaces, the design compensates for resin's low thermal conductivity through enhanced convective cooling, maintaining cost-effectiveness while improving heat dissipation.
Solution Approach 2:
The design utilizes pneumatic principles by establishing multiple air flow pathways through vent holes on different surfaces. This enhances convective heat transfer from the housing body to the surrounding environment, compensating for resin's poor thermal conductivity and improving overall heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures consistent cooling of the electronic device's internal components by maintaining airflow through vent holes, preventing overheating even when peripheral devices obstruct the vent holes, thus maintaining efficient thermal management.
Implementation Method 1
performs ventilation between an inner part and an outer part of the main housing body through the vent holes to cool the inner part of the main housing body
Data Source
AI summary
The present invention is an electronic device unit including an electronic device that has air inlets formed on a bottom surface of a main housing body having electronic components housed therein, and that introduces air to an inner part of the main housing body through the air inlets to cool the inner part of the main housing body, and a battery pack that is attached to the main housing body in a state where a battery case covers a part of a portion being an extensional region of the air inlets, wherein a surrounding wall part is provided on the bottom surface of the main housing body to surround a ventilation region in which the air inlets are provided and to be open at a portion facing the ventilation region, and the battery case is attached to the main housing body via protruding ends of the surrounding wall part.