HSP Distribution Body Shield Element for Deposition Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Large panel sizes in the electronic industry for printed circuit boards pose challenges in achieving uniform electrochemical deposition of copper due to macroscopic uneven distribution of metal lines, leading to inefficiencies in High Speed Plating systems, which become time-consuming and expensive to manufacture for varying panel designs and sizes.
Innovation Solution
A distribution system comprising a distribution body with separate openings for process fluid and electric current, controlled by a shield element that can independently adjust the flow of both, allowing for targeted deposition rate adjustments to achieve uniformity across differently dense substrate structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If High Speed Plating systems are used to improve deposition uniformity, then deposition uniformity is improved, but manufacturing complexity and cost increase for varying panel designs and sizes
Solution Approach 1:
The distribution body is segmented into multiple independent HSP units, each with its own distribution characteristics. This allows the system to handle varying panel designs by activating only the necessary HSP units, reducing the effective complexity for each specific application while maintaining overall system capability.
Solution Approach 2:
The HSP distribution body is designed as a universal system that can process multiple panel designs and sizes through the use of multiple HSP units with different distribution characteristics. This multi-functionality allows a single system to adapt to varying requirements without requiring complete remanufacturing for each new panel design.
2Manufacturing precision
If HSP units are customized for specific panel designs to achieve uniform deposition, then deposition uniformity is improved, but manufacturing time and cost increase
Solution Approach 1:
Multiple HSP units with different distribution characteristics are pre-configured in the distribution body during manufacturing. When processing different panel designs, the appropriate HSP units are already in place and can be activated immediately, eliminating the need for time-consuming custom manufacturing for each new panel design.
Solution Approach 2:
The system transitions from static, custom-manufactured HSP units to a dynamic configuration where multiple standardized HSP units can be selectively activated or deactivated based on the specific panel design requirements. This dynamic adaptability reduces manufacturing time while maintaining deposition uniformity.
3Manufacturing precision
If electrolyte jets are directed through HSP plates to improve current distribution, then deposition uniformity is improved, but system complexity and manufacturing cost increase for large panels
Solution Approach 1:
The distribution system is divided into multiple independent HSP units, each creating localized electrolyte jets with specific distribution patterns. This segmentation allows complex overall distribution requirements for large panels to be achieved through combinations of simpler, standardized HSP units, managing system complexity through modularity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system ensures better deposition uniformity by balancing irregular deposition rates across dense and non-dense structures, isolated and non-isolated areas, and edge regions, reducing the need for frequent HSP unit remanufacturing and exchange.
Implementation Method 1
outlet openings on the front face through which process solution flows onto the substrate surface
Implementation Method 2
outlet openings on the front face through which process solution and/or electrical current flows onto the substrate surface
Implementation Method 3
The shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid and/or of the electrical current through the distribution body
Implementation Method 4
electrochemical deposition of copper (or other electrically conducting materials) is being used to create these interconnects
Data Source
AI summary
The invention relates to a distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate, a distribution method for a process fluid for chemical and/or electrolytic surface treatment of a substrate and a data processing device. The distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate comprises a distribution body and a shield element. The distribution body comprises a plurality of openings for the process fluid. The shield element is configured to at least partially cover at least one of the plurality of openings to limit a flow of the process fluid through the distribution body.