High Temperature Electrostatic Chuck Ceramic Body Stress Reduction
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Solution Overview
Problem
Conventional electrostatic chucks used in semiconductor processing at high temperatures above 300 degrees Celsius experience surface damage and premature failure due to thermal cycling and stress concentration, leading to cracking.
Innovation Solution
A high temperature electrostatic chuck (HT ESC) with a ceramic body and a chucking mesh embedded within, featuring backside gas channels and a dimpled electrode mounting portion to increase material thickness and reduce stress concentration, along with an electrode accessible from the bottom surface to maintain chucking behavior without cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional electrostatic chuck is used for high temperature processing above 300 degrees Celsius, then substrate processing capability is achieved, but surface damage and cracking occur due to thermal cycling and stress concentration
Solution Approach 1:
The patent changes the material parameter from conventional materials to ceramic material, which has superior thermal stability and resistance to thermal cycling. This parameter change enables the ESC to withstand processing temperatures above 300 degrees Celsius without surface damage and cracking, directly resolving the contradiction between high temperature capability and reliability.
2Ease of operation
If electrode is mounted close to workpiece mounting surface, then chucking effectiveness is improved, but stress concentration increases leading to cracking
Solution Approach 1:
The patent applies local quality by creating a recessed mounting portion specifically at the electrode location. This local structural modification allows the electrode to be positioned optimally for chucking effectiveness while the recessed design distributes stress away from critical areas, preventing cracking. The local quality change resolves the contradiction between chucking effectiveness and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The HT ESC effectively supports substrates at temperatures exceeding 300 degrees Celsius without cracking, enhancing the durability and longevity of the substrate support assembly by distributing thermal stress and maintaining electrostatic adhesion.
Implementation Method 1
A substrate support assembly may hold, or chuck, the substrate on an electrostatic chuck (ESC)
Data Source
AI summary
Implementations of the present disclosure include methods and apparatuses utilized to reduce cracking of the substrate support surface of a high temperature electrostatic chuck within a processing chamber. In one implementation, a high temperature electrostatic chuck has a ceramic body. The ceramic body has a workpiece mounting surface and a bottom surface. A plurality of backside gas channels are formed in the workpiece mounting surface. A chucking mesh disposed in the ceramic body has a main chucking portion spaced a first distance from the workpiece mounting surface and an electrode mounting portion spaced a second distance from the workpiece mounting surface, wherein the second distance is greater than the first distance. An electrode is coupled the electrode mounting portion and is accessible from the bottom surface.