Multi-Filament HTS Cable Structure for Quench-Resistant Flexibility
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Solution Overview
Problem
Commercially available high-temperature superconductor (HTS) wires lack sufficient AC current carrying capacity and mechanical flexibility, and are prone to failure during quench events due to high contact resistance between stacked tape segments, which limits current sharing and integrity.
Innovation Solution
A multi-filament HTS cable is developed without a substrate or buffer layer, with filaments stacked and twisted for improved electrical communication, secured using low-temperature solder or external wrapping, achieving low contact resistance and enhanced mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If HTS material is grown epitaxially on a substrate to achieve high current carrying capability, then the crystalline alignment and current carrying capability are improved, but the mechanical flexibility and ease of winding are deteriorated
Solution Approach 1:
The patent divides the HTS conductor into multiple independent filaments (typically 7-19 filaments per strand, with multiple strands per cable). Each filament contains a thin HTS layer (1-3 μm) on a flexible substrate, and the filaments are stacked and twisted together. This segmentation allows each filament to be flexible while collectively achieving high current carrying capability through the combined cross-sectional area of all filaments.
2Length of moving object
If wide tape is mechanically sliced to narrower widths, then the desired narrow width is achieved, but the integrity and strength of the HTS tape are deteriorated
Solution Approach 1:
Instead of slicing a single wide tape into narrow strips (which weakens each strip), the patent creates multiple narrow filaments by depositing HTS layers on separate substrates and then stacking them. This approach maintains the full current carrying capacity equivalent to the original wide tape while each filament retains its structural integrity and flexibility.
3Strength
If substrate and buffer layers are included in HTS wire construction, then structural integrity is improved, but the flexibility and ability to form tight bends are deteriorated
Solution Approach 1:
The patent uses extremely thin substrate and buffer layers (total thickness 10-50 μm) compared to conventional HTS tapes (100-150 μm). The substrate is made from flexible materials such as Hastelloy or Inconel with thin gauge. These thin-film constructions allow the filaments to be highly flexible while maintaining sufficient structural integrity to support the brittle HTS layer during handling and winding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved AC current carrying capacity, flexibility, and current sharing between superconducting layers, protecting against quench events and maintaining cable integrity, while allowing for denser and uniform winding in applications.
Implementation Method 1
high temperature superconductor (HTS) materials can carry extremely large amounts of current with extremely low loss. HTS materials lose all resistance to the flow of direct electrical current and nearly all resistance to the flow of alternating current when cooled below a critical temperature
Implementation Method 2
secured using low-temperature solder or external wrapping, achieving low contact resistance and enhanced mechanical strength
Data Source
AI summary
A multi-filament high temperature superconducting cable having improved AC current carrying capacity, quench resistance and flexibility. The multi-filament cable is formed from a plurality of stacked exfoliated filaments which provide current sharing between adjacent superconducting layers.