HTS Interconnect Cable Layout for Low-Thermal Cryogenic Links
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Solution Overview
Problem
CMOS-based digital circuits face power consumption issues due to energy dissipation and current leakage even when inactive, limiting their performance and efficiency, especially when integrated with superconducting logic devices that require lower temperatures for operation.
Innovation Solution
A high temperature superconductor (HTS)-based interconnect system that includes a substrate layer, a high temperature superconductor layer, and a metallic layer, along with a thermal load management system to maintain the interconnects at a temperature range of 60 kelvin to 92 kelvin, allowing for efficient interconnection of cryogenic and non-cryogenic electronics with minimal thermal loading and electrical loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If CMOS circuits are used for digital processing, then high-speed operation is achieved, but power consumption increases due to energy dissipation and current leakage
Solution Approach 1:
The patent introduces an intermediary conversion system between superconducting logic (cryogenic) and CMOS (non-cryogenic) domains. This mediator enables high-speed superconducting processing while isolating the power consumption issues from the CMOS side, allowing high-speed operation without direct CMOS power dissipation problems.
Solution Approach 2:
The patent changes the operating temperature parameter from room temperature (CMOS) to cryogenic temperatures (superconducting logic). This parameter change enables zero-resistance operation and eliminates current leakage, achieving high-speed operation with dramatically reduced power consumption.
2Use of energy by moving object
If superconducting logic devices are used, then power consumption is reduced, but operation requires lower temperatures
Solution Approach 1:
The patent segments the system into two distinct temperature zones: a cryogenic zone for superconducting logic devices (low power consumption) and a non-cryogenic zone for CMOS electronics (room temperature operation). This segmentation allows each component to operate in its optimal temperature range, reducing overall power consumption without requiring the entire system to be cryogenic.
Solution Approach 2:
The patent uses an intermediary interface that couples superconducting logic with CMOS electronics across different temperature boundaries. This intermediary enables the superconducting section to operate at low temperatures for minimal power consumption while the CMOS section operates at room temperature, resolving the temperature requirement issue.
3Adaptability or versatility
If cryogenic electronics are interconnected with non-cryogenic electronics, then system versatility is improved, but thermal loading increases
Solution Approach 1:
The patent segments the interconnect system into cryogenic and non-cryogenic sections, with each section optimized for its temperature range. This segmentation allows versatile integration of different electronics types while minimizing thermal loading by keeping the cryogenic section isolated and using efficient thermal management at the interface.
Solution Approach 2:
The patent applies different material and design qualities to different parts of the interconnect system: superconducting materials and designs in the cryogenic section for minimal thermal conduction, and conventional materials in the non-cryogenic section. This local quality optimization enables system versatility while reducing overall thermal loading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The HTS-based interconnect system enables high-speed, low-loss signal transmission over long distances with high signal density, reducing power consumption and thermal loading, and eliminates the need for active electronics, thereby improving the efficiency of cryogenic and non-cryogenic system integration.
Implementation Method 1
a high temperature superconductor layer formed over the substrate layer in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion
Implementation Method 2
a thermal load management system comprising at least one heat transfer element coupled to the intermediate portion of each of the plurality of HTS-based interconnects
Data Source
AI summary
High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.