HTS Josephson Junctions via Nanoscale Probe Voltage Patterning

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Solution Overview

Problem

Current methods for fabricating high temperature superconducting (HTS) devices, such as Josephson tunnel junctions, are costly and time-consuming, with limitations in thickness and electrical properties due to the use of photolithography and ion beam techniques, which restrict the potential of HTS materials in practical applications.

Innovation Solution

The use of a nanoscale probe tip to apply external voltages to HTS materials, enabling direct writing of circuits by converting specific regions from superconducting to insulating, thereby fabricating high-quality Josephson superconducting tunnel junctions with improved resolution and efficiency using Atomic Force Microscopy (AFM) technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If photolithography and ion beam techniques are used to fabricate HTS devices, then circuit features can be defined, but the process becomes costly and time-consuming

Engineering Contradiction:
Improvecircuit feature definitionVSAvoidfabrication speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces the mechanical ion beam system with an electrical field-based nanoscale probe tip that applies high voltage to induce superconductor-to-insulator transition. This substitution eliminates the need for complex ion beam equipment and reduces fabrication time while maintaining patterning precision.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental parameter from ion beam physical sputtering to electrical voltage-induced phase transition. By applying high voltage through the nanoscale probe tip, the superconducting material undergoes a parameter change from superconducting state to insulating state, enabling direct circuit writing without ion beam processing.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If ion beam techniques are used, then circuits can be written, but the beam must be projected through the material which restricts thickness to approximately 40 nm

Engineering Contradiction:
Improvecircuit writing capabilityVSAvoidHTS material thickness
Core Design Contradiction:
Manufacturing precisionVSLength of stationary object

Solution Approach 1:

The patent replaces the ion beam projection method with direct electrical field application through a nanoscale probe tip. This allows the electrical field to penetrate and act on the HTS material throughout its thickness without being blocked, enabling processing of materials much thicker than 40 nm while maintaining precise circuit writing capability.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Shape

If photolithography and dry ion etching are used, then HTS thin films can be shaped, but the process is complex and time-consuming

Engineering Contradiction:
ImproveHTS thin film patterningVSAvoidfabrication process complexity
Core Design Contradiction:
ShapeVSDevice complexity

Solution Approach 1:

The patent merges multiple separate processes (photolithography, etching, and material deposition) into a single integrated step. The nanoscale probe tip simultaneously performs patterning and creates the insulating regions needed for Josephson junctions, eliminating the need for separate photolithography and etching steps and significantly reducing process complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the intermediate photolithography step from the fabrication process. By using the nanoscale probe tip to directly write circuits through voltage application, the method removes the need for photoresist coating, exposure, and development steps, simplifying the overall process while achieving the same patterning result.

Inventive Principle:
Principle #2Taking out (Extraction)

4Reliability

If conventional methods are used, then devices can be fabricated, but electrical properties and possible configurations are limited

Engineering Contradiction:
Improveelectrical propertiesVSAvoiddevice configuration flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by using the nanoscale probe tip to create spatially varying insulating regions within the HTS material. Different regions can be selectively transformed to insulating state with precise control over location, size, and shape, enabling diverse device configurations and optimizing electrical properties for specific application requirements.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method allows for faster, cheaper, and higher-resolution fabrication of HTS devices, overcoming the limitations of traditional techniques by enabling the patterning of thicker HTS materials and improving electrical properties, thus enhancing their potential in various applications.

Implementation Method 1

apply high voltages through the nanoscale tip to HTS materials in order to achieve the superconductor-insulator transition

Methodology Applied
Scientific EffectSuperconductor-insulator transition: Superconductivity

Data Source

PatentUS20240389476A1High temperature superconducting devices and methods thereof
Publication Date: 2024.11.21 RGT UNIV OF CALIFORNIA
  • US20240389476A1 patent drawing
  • US20240389476A1 patent drawing
  • US20240389476A1 patent drawing

AI summary

A high temperature superconducting device including a substrate, a high temperature superconducting thin film disposed on the substrate and one or more non-superconducting thin film regions formed adjacent to and across a substantially entire thickness of the high temperature superconducting thin film. In the high temperature superconducting device, the one or more non-superconducting thin film regions are formed from degrading corresponding superconducting materials same to the high temperature superconducting thin film through applying an external voltage. In addition, the one or more non-superconducting thin film regions and the high temperature superconducting thin film form one or more Josephson tunnel junctions.