HTS Tape Bundling via Transverse Slot Alignment
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Solution Overview
Problem
Existing cabling equipment is not well-suited for bundling high temperature superconductor (HTS) wires with rectangular cross-sectional geometry, leading to inefficient and costly bundling processes.
Innovation Solution
A system and method involving alignment devices to impart a twist pitch in HTS tapes, using slots oriented at specific angles to plastically deform and bundle the tapes, followed by a forming member to create a flexible cable with a controlled twist pitch, and an overwrap for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional cabling equipment is used for bundling HTS wires, then the equipment can process round wires, but it is not well suited for rectangular cross-sectional HTS wires leading to inefficient and costly bundling processes
Solution Approach 1:
The invention changes the geometric parameters of the HTS wires by imparting a twist to them, transforming their configuration from straight rectangular sections to twisted structures. This allows conventional equipment to effectively handle the wires by modifying their physical state rather than modifying the equipment itself
Solution Approach 2:
The alignment devices perform preliminary actions by guiding and positioning the HTS wires at specific angles before the twisting occurs. This preliminary alignment ensures that the wires are properly oriented for the subsequent twisting process, enabling efficient bundling without requiring specialized equipment for rectangular cross-sections
2Reliability
If HTS wires are loosely bundled for packaging in cryostat, then thermal and electrical isolation is achieved, but wire damage occurs during the bundling process
Solution Approach 1:
The alignment devices act as intermediaries between the wire feeding mechanism and the twisting process. These devices gently guide and support the HTS wires through slots, preventing direct contact and damage during the bundling process while still enabling the necessary twisting action
Solution Approach 2:
The alignment devices provide protective support before the wires undergo twisting, cushioning them against damage during the transition from straight to twisted configuration. This preliminary protection ensures wire integrity is maintained throughout the bundling process
3Manufacturing precision
If alignment devices with slots oriented at specific angles are used, then twist pitch is precisely controlled, but device complexity increases
Solution Approach 1:
The alignment devices are segmented into multiple slots, each oriented at specific angles to guide individual wires. This segmentation allows precise control of twist pitch for each wire while maintaining a relatively simple overall device structure that can be easily adjusted
Solution Approach 2:
The spacing between the first and second alignment devices is made adjustable, allowing dynamic control of the twist pitch. This dynamic adjustment capability enables precise control without requiring complex fixed-geometry structures, simplifying the overall device design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces wire damage and manufacturing costs by efficiently bundling HTS wires into a flexible power cable with precise control over twist pitch and protection.
Implementation Method 1
The first angle being transverse to the second angle so as to plastically deform the plurality of tapes and impart a twist pitch in the plurality of high temperature superconductor tapes
Data Source
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AI summary
A system for bundling a plurality of high temperature superconductor tapes into a flexible cable, includes a first alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of the tapes arranged with a wide surface oriented at a first angle. There is a second alignment device for receiving and guiding there through the plurality of high temperature superconductor tapes, each of said tapes arranged with the wide surface oriented at a second angle. The first angle is transverse to the second angle and plastically deforms the tapes to impart a twist pitch in the tapes. There is a forming member spaced from the second alignment device for receiving the plurality of high temperature superconductor tapes with the imparted twist pitch and forming them into a bundle of high temperature superconductor tapes of the high temperature superconductor tapes with the imparted twist pitch.