HTS Tape Stabilizer Electrodeposition Without Capping Layer
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Solution Overview
Problem
The commercialization of high-temperature superconductors is hindered by challenges in fabricating superconducting tape segments, particularly due to the need for a capping layer that is costly and reactive, which affects the critical current of the superconducting layer, and the complexity of manufacturing second-generation HTS tapes with layered structures.
Innovation Solution
A method involving the electrodeposition of a stabilizer layer over a high-temperature superconducting layer using a non-reactive solution, which preserves at least 95% of the as-formed critical current, allowing for the potential reduction or elimination of the capping layer and enabling the production of longer, more cost-effective superconducting tapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a capping layer is used to protect the superconducting layer, then the superconducting layer is protected from chemical reactions, but the critical current is reduced and material costs increase
Solution Approach 1:
The patent removes the capping layer from the superconducting tape structure, extracting the problematic component that reduced critical current. The stabilizer layer is directly deposited on the superconducting layer without an intervening capping layer, eliminating the harm caused by the capping layer while maintaining protection through the non-reactive electrodeposition process
Solution Approach 2:
The patent introduces a non-reactive electrodeposition solution as an intermediary medium that enables direct contact between the stabilizer layer and superconducting layer without chemical reactions. This mediator allows the stabilizer to be deposited directly on the superconducting layer, eliminating the need for a capping layer while preserving the superconducting properties
2Reliability
If a capping layer is used to protect the superconducting layer, then the superconducting layer is protected from chemical reactions, but material costs and manufacturing complexity increase
Solution Approach 1:
The patent extracts and removes the capping layer from the multi-layer structure, simplifying the overall device architecture. By eliminating this intermediate layer, the manufacturing process becomes less complex and material costs are reduced while the stabilizer layer directly protects the superconducting layer through non-reactive electrodeposition
Solution Approach 2:
The patent merges the protective function previously performed by the capping layer directly into the stabilizer layer deposition process. The stabilizer layer is deposited directly on the superconducting layer, combining the protection function with the stabilization function in a single integrated layer, thereby reducing structural complexity
3Ease of manufacture
If conventional electrodeposition solutions are used, then the stabilizer layer can be deposited, but the superconducting layer is damaged and critical current is reduced
Solution Approach 1:
The patent changes the chemical parameters of the electrodeposition solution to make it non-reactive toward the superconducting layer. By modifying the solution composition and deposition parameters, the stabilizer layer can be deposited without damaging the superconducting properties, thereby maintaining critical current while enabling ease of manufacture
Solution Approach 2:
The patent uses a specially formulated non-reactive electrodeposition solution as an intermediary medium that enables the stabilizer layer deposition process without causing chemical reactions with the superconducting layer. This mediator allows the deposition to proceed while preserving the superconducting critical current
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach maintains a high critical current post-stabilization, facilitating the production of longer, cost-effective superconducting tapes with improved commercial viability by reducing material costs and manufacturing complexities.
Implementation Method 1
electrodepositing a stabilizer layer overlying the superconducting layer using a solution that is non-reactive to the superconducting layer
Data Source
Figure 1
AI summary
A method of forming a superconducting article includes providing a substrate tape, forming a superconducting layer overlying the substrate tape, and depositing a capping layer overlying the superconducting layer. The capping layer includes a noble metal and has a thickness not greater than about 1.0 micron. The method further includes electrodepositing a stabilizer layer overlying the capping layer using a solution that is non-reactive to the superconducting layer. The superconducting layer has an as-formed critical current IC(AF) and a post-stabilized critical current IC(PS). The IC(PS) is at least about 95% of the IC(AF).