HTS Wire Defect Patching via Overlap Lamination
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Solution Overview
Problem
High temperature superconducting (HTS) wires often suffer from defects such as fractures and incorrect crystallographic orientation during fabrication, leading to increased resistance and reduced current-carrying capability, which existing methods address by cutting and external splicing, resulting in rigidity issues and potential damage during bending.
Innovation Solution
A patching method where a second segment of HTS wire with lower resistance is positioned to overlap the defective area, bonded with a low resistance solder, creating a conductive path around the defect before lamination, eliminating the need for cutting and reducing thickness, thus enhancing flexibility and avoiding sharp edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external splicing is used to address defects in HTS wire, then the defect is remedied by bonding cut ends together, but the thickness and rigidity increase at the splice area causing flexibility problems
Solution Approach 1:
The patent applies preliminary action by addressing the defect through patching before the lamination process is completed. The patch is applied to the HTS insert while it is still accessible, allowing the defect to be remedied without requiring subsequent cutting and splicing operations that would compromise flexibility.
Solution Approach 2:
The patent segments the defect treatment by isolating the defective area and applying a patch only to that specific location, rather than requiring cutting and splicing of the entire wire. This localized approach maintains the original flexibility of the HTS wire while remedying the defect.
2Reliability
If external splicing is used to address defects in HTS wire, then the defect is remedied, but the rigidity at the overlap area can damage the HTS wire during bending
Solution Approach 1:
The patch is applied to the HTS insert before lamination, preventing the need for rigid external splicing later. This preliminary defect remediation preserves the wire's ability to bend without damage while still addressing the defect.
Solution Approach 2:
The patent applies local quality by treating only the defective area with a patch, maintaining the original properties of the rest of the wire. This localized treatment preserves the flexibility and integrity of the HTS wire in non-defective areas.
3Reliability
If conventional external splicing is used, then defects are addressed by cutting and bonding, but this creates a thicker, less flexible area that does not conform to cylindrical surfaces
Solution Approach 1:
The patch is applied to the HTS insert before lamination, maintaining a sleek profile that conforms to cylindrical surfaces. This preliminary approach avoids the thickness increase associated with external splicing, preserving the wire's ability to bend and conform to desired shapes.
4Reliability
If defects are addressed after lamination by cutting and splicing, then the defect is remedied, but sharp edges are created in the area of the defect
Solution Approach 1:
The patch is applied to the HTS insert before lamination, allowing the lamination process to create a smooth, continuous surface without sharp edges. This preliminary defect remediation ensures that the final laminated wire has a uniform surface profile.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for continuous lamination without cutting, reducing thickness and rigidity issues, maintaining current flow while minimizing power losses and damage from bending, by addressing defects before lamination and creating a flexible, seamless path around the defect.
Implementation Method 1
The bond layer establishes a path such that current flows through the second segment of high temperature superconducting wire
Implementation Method 2
The bond layer may include low resistance solder
Implementation Method 3
High temperature superconductors are materials that, when cooled below a critical temperature, are capable of carrying extremely large currents with extremely low loss
Data Source
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AI summary
A method includes locating a defect (202) in a first segment of high temperature superconducting wire (200). A second segment of high temperature superconducting wire (310) is then positioned onto the first segment of high temperature superconducting wire such that the second segment of high temperature superconducting wire overlaps the defect. A path is then created such that current flows through the second segment of high temperature superconducting wire. The first segment of high temperature superconducting wire and second segment of high temperature superconducting wire are then laminated together.