HTSOI Half-Bridge Gate Driver for 200°C Operation

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Solution Overview

Problem

Existing half-bridge gate drivers are limited in their ability to provide comprehensive functionality, including multiple level logic inputs, noise immunity, fault protection, and high-frequency modulation, especially in high-temperature environments, and lack integration of advanced protection features like overcurrent protection and undervoltage lockout in a compact and robust package.

Innovation Solution

A high-temperature silicon on insulator (HTSOI) application-specific integrated circuit (ASIC) gate driver is developed, incorporating multiple level logic inputs, noise immunity, fault protection, pulse modulation with transformer-based isolation, high-frequency demodulation, deadtime generation, level shifting for high-side transistors, overcurrent protection, and undervoltage lockout, utilizing current-starved inverters and integrated delay circuits, and featuring a compact robust design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If existing half-bridge gate drivers are used, then basic gate driving function is provided, but comprehensive functionality including multiple level logic inputs, noise immunity, fault protection, and high-frequency modulation is limited

Engineering Contradiction:
Improvecomprehensive functionalityVSAvoidcircuit complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple previously separate gate driver circuits into a single integrated HTSOI ASIC that provides comprehensive functionality including multiple level logic inputs, noise immunity, fault protection, overlap protection, pulse modulation, high-frequency modulation with transformer-based isolation, high-frequency demodulation, deadtime generation, level shifting, overcurrent protection, and undervoltage lockout. This merging approach achieves comprehensive functionality while maintaining a compact robust package.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The HTSOI ASIC gate driver is designed as a universal circuit that can perform multiple functions simultaneously - it handles both low-side and high-side transistor control, provides various protection features, supports multiple modulation schemes, and operates across a wide temperature range. This multi-functionality allows a single device to replace multiple separate circuits.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If advanced protection features like overcurrent protection and undervoltage lockout are integrated, then fault protection capability is improved, but device complexity increases

Engineering Contradiction:
Improvefault protection capabilityVSAvoidcircuit complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates overcurrent protection, undervoltage lockout, and other advanced protection features into the same HTSOI ASIC that provides basic gate driving functions. By combining these protection circuits with the main gate driver functionality in a single integrated device, the patent achieves enhanced reliability without proportionally increasing overall system complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Object-affected harmful factors

If transformer-based isolation and high-frequency modulation are implemented, then noise immunity and isolation capability are improved, but device complexity and size increase

Engineering Contradiction:
Improvenoise immunityVSAvoidcircuit complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent merges the transformer-based isolation circuitry with the high-frequency modulation and demodulation functions into a single integrated block within the HTSOI ASIC. This integration approach provides effective noise immunity and galvanic isolation while avoiding the need for separate discrete isolation components, thereby controlling overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

4Area of stationary object

If multiple functions are integrated in a compact package, then space efficiency is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvepackage sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent utilizes high-temperature silicon-on-insulator (HTSOI) technology, which changes the manufacturing parameters and processes compared to standard silicon technology. This specialized process enables the integration of multiple functions including protection circuits, modulation circuits, and isolation transformers in a compact package while maintaining manufacturability through established HTSOI fabrication techniques.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The HTSOI ASIC gate driver effectively addresses the limitations of existing technologies by providing comprehensive functionality in high-temperature environments, ensuring reliable operation with enhanced noise immunity, fault protection, and efficient modulation capabilities while maintaining a compact and robust design.

Implementation Method 1

high-frequency modulation with transformer based isolation, high-frequency demodulation

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8643407B2High temperature half bridge gate driver
Publication Date: 2014.02.04 WOLFSPEED INC
  • US8643407B2 patent drawing
  • US8643407B2 patent drawing
  • US8643407B2 patent drawing

AI summary

A half bridge gate driving circuit for providing gate driving circuits in a bi-hecto celcius (200 degrees celcius) operating environment having multiple functions including combinations of multiple level logic inputs, noise immunity, fault protection, overlap protection, pulse modulation, high-frequency modulation with transformer based isolation, high-frequency demodulation back to pulse width modulation, deadtime generator, level shifter for high side transistor, overcurrent protection, and undervoltage lockout.