Hub Chiplet with D2D Connections for Scalable AI Processing

The patent applies chiplet technology that divides a large chip into multiple smaller chiplets with different functions (e.g., compute chiplets, memory chiplets, I/O chiplets). Each chiplet can be manufactured independently using standard processes, avoiding the need to reduce line width across an entire large chip. This segmentation resolves the contradiction by enabling smaller effective chip size while maintaining manufacturing ease through modular fabrication.

By segmenting the chip into multiple independent chiplets, the patent reduces the impact of leakage current on overall yield. Each chiplet can be optimized for its specific function with appropriate dimensions, avoiding the need to scale down the entire chip. This segmentation allows for better control of leakage current in each module while maintaining high integration through modular assembly.

The patent creates a universal chiplet architecture with standardized interfaces and connection methods that can be applied across different computing configurations. The same chiplet designs can be combined in various ways to achieve different computing performance levels, eliminating the need to develop entirely new SoC devices for each scale requirement. This multi-functionality reduces development time while maintaining performance scalability.

The patent segments the computing system into standardized chiplet modules that can be manufactured using existing processes and then assembled through chip-scale packaging. This approach avoids the need to develop new SoC devices from scratch for each performance level, reducing manufacturing costs through reuse of proven chiplet designs and standardized interconnection methods while achieving scalable computing performance.