HUD Temperature Control via Light Intensity Reduction
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Solution Overview
Problem
Head-up display devices are prone to excessive temperature due to ambient light irradiation, which can lead to damage and reduce the service life of the device.
Innovation Solution
The head-up display device incorporates a processing unit and an imaging unit with first temperature sensors on the circuit board, which surrounds the optical modulation module. When the temperature exceeds a threshold, the processing unit reduces the intensity of the illumination light beam and may adjust the position of reflecting mirrors to manage heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the head-up display device is exposed to ambient light beams via the reflector, then the display function is achieved, but the temperature of the display device increases excessively causing damage or reduced service life
Solution Approach 1:
The patent applies preliminary action by placing temperature sensors on the circuit board before excessive heating occurs, enabling early detection of temperature rise trends. The system proactively reduces light source intensity or shuts down the light source module when temperature thresholds are approached, preventing catastrophic overheating damage before it occurs.
Solution Approach 2:
The patent implements feedback control through temperature sensors that continuously monitor the circuit board temperature and feed this information back to the control unit. Based on the feedback signal, the control unit dynamically adjusts the light source intensity or shuts it down, creating a closed-loop control system that maintains temperature within safe operating limits while preserving display functionality.
2Measurement precision
If temperature sensors are integrated on the circuit board surrounding the optical modulation module, then temperature control precision is improved, but the device complexity increases
Solution Approach 1:
The patent merges the temperature sensing function with the existing circuit board structure by integrating temperature sensors directly onto the circuit board that already surrounds the optical modulation module. This consolidation approach enables precise temperature monitoring of critical components without adding separate sensor assemblies or increasing overall device complexity, as the circuit board serves dual purposes: electrical connectivity and thermal monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively controls the temperature of the head-up display device, ensuring normal operation, extending its service life, and reducing manufacturing costs while maintaining a compact device size.
Implementation Method 1
The optical modulation module is configured to convert an illumination light beam emitted by the light source module into an image light beam
Implementation Method 2
The plurality of first temperature sensors are disposed on the circuit board... obtain a plurality of temperatures from the plurality of first temperature sensors
Implementation Method 3
When a highest temperature of the plurality of temperatures is greater than a threshold value, the processing unit is adapted to enable the light source module to reduce an intensity of the illumination light beam
Implementation Method 4
it is necessary to use a reflector to transmit the image light beam to the windshield and to the driver's eyes
Data Source
AI summary
A head-up display device includes a processing unit and an imaging unit. The imaging unit includes a light source module, an optical modulation module, a circuit board, and a plurality of first temperature sensors. The circuit board surrounds the optical modulation module. The plurality of first temperature sensors are disposed on the circuit board. The circuit board is electrically connected to the plurality of first temperature sensors and the optical modulation module. The processing unit is electrically connected to the light source module and the circuit board to obtain a plurality of temperatures from the plurality of first temperature sensors. When a highest temperature of the plurality of temperatures is greater than a threshold value, the processing unit is adapted to enable the light source module to reduce an intensity of the illumination light beam. A temperature control method of a head-up display device is also proposed.