Humidity-Controlled Electronic Assemblies for PV Modules
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Solution Overview
Problem
Photovoltaic (PV) module electronics face moisture ingress issues due to atmospheric humidity, leading to condensation and corrosion, with existing protection methods like potting materials and conformal coatings being costly, inefficient, or causing mechanical stress, and conventional humidity control systems being unsuitable for PV modules.
Innovation Solution
A humidity-controlled electronic component assembly within the PV module enclosure, featuring a power conditioning circuit and a humidity control circuit with a heating component to regulate moisture levels, which can include a humidity sensor and control unit to actively manage humidity, preventing condensation and corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional humidity control systems are used in PV modules, then moisture protection is improved, but device complexity and suitability for PV modules deteriorates
Solution Approach 1:
The heating component utilizes waste heat generated by the power conditioning circuit electronics to drive moisture off the circuit board, eliminating the need for external power sources or complex control systems. The system serves itself by using its own operational byproduct (heat) to solve the moisture problem.
Solution Approach 2:
The humidity control function is merged with the existing power conditioning circuit by integrating a heating component into the circuit board assembly. This combines the power conditioning electronics and moisture protection into a single integrated unit, reducing overall system complexity.
2Reliability
If potting materials or conformal coatings are used to protect electronics, then moisture protection is improved, but manufacturing cost and mechanical stress increase
Solution Approach 1:
The patent extracts the moisture protection function from complex manufacturing processes (potting materials, conformal coatings) and implements it through a simple heating component that can be integrated directly into the circuit board. This eliminates costly manufacturing steps while maintaining protection effectiveness.
Solution Approach 2:
The heating component provides a simple, low-cost alternative to expensive potting materials and coatings. It uses minimal materials (essentially just the heating element and trace amounts of thermal interface material) compared to the substantial amounts of costly encapsulant or coating materials required by conventional methods.
3Reliability
If potting materials or conformal coatings are used, then moisture protection is improved, but mechanical stress on components worsens
Solution Approach 1:
The patent removes the mechanical stress-inducing materials (potting compounds, conformal coatings) entirely and replaces them with a thermal-based moisture removal approach. This extraction eliminates the source of mechanical stress while maintaining moisture protection through active humidity control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents moisture-related failures in PV module electronics by actively regulating humidity levels, reducing the risk of condensation and corrosion, and enhancing the reliability and longevity of PV systems without the drawbacks of traditional protection methods.
Implementation Method 1
a first heating component and a control unit, both within the enclosure. The control unit is configured to actuate the first heating component if a measured humidity level within the enclosure is above a predetermined maximum humidity level
Implementation Method 2
a humidity sensor and control unit to actively manage humidity
Data Source
AI summary
Photovoltaic (PV) assemblies and modules for converting solar radiation to electrical energy are disclosed. A PV module comprises a plurality of PV or solar cells for generating DC power. In some embodiments, the plurality of solar cells are encapsulated within a PV laminate. A PV assembly comprises an electronic component assembly coupled to the PV module. The electronic component assembly comprises an enclosure defining an interior region and a power conditioning circuit within the interior region of the enclosure. The power conditioning circuit comprises at least one electronic component for conditioning power generated by the plurality of solar cells. The electronic component assembly comprises a first electrical conduit for inputting direct current (DC) generated by the plurality of solar cells to the power conditioning circuit. The electronic component assembly further comprises a second electrical conduit for outputting conditioned power from the power conditioning circuit. Additionally, the electronic component assembly comprises a humidity control circuit within the enclosure for performing a dehumidification operation. The humidity control circuit comprises a first heating component and regulates a moisture or humidity level within the interior region of the enclosure.