Humidity-Sealed Electronics Module for Industrial Field Devices
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Solution Overview
Problem
Humidity and moisture in industrial process environments can damage electronic circuitry in field devices, leading to measurement or control accuracy issues and the formation of unwanted current paths due to dendrite formation, particularly affecting sensitive components like optocouplers and voltage references.
Innovation Solution
A humidity-sealed electronics module is introduced, which separates the housing into compartments to protect at-risk electrical components from moisture, using seal boards and enclosures made of materials that prevent humidity ingress, ensuring the reliability and lifespan of field devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are exposed to industrial process environments, then the field device can perform its monitoring or control function, but humidity and moisture can enter the housing and damage or degrade the electronic circuitry
Solution Approach 1:
The housing is divided into separate compartments: a first compartment containing process electronics and a second compartment containing humidity-sensitive electronics. This segmentation isolates sensitive components from harmful environmental factors while maintaining overall device functionality.
Solution Approach 2:
A feedthrough acts as an intermediary element that passes electrical signals between compartments while maintaining the seal. The feedthrough allows necessary electrical connectivity without compromising the humidity barrier between compartments.
2Reliability
If the housing is sealed to protect electronics from humidity, then electronic circuitry is protected, but thermal expansion and contraction can cause stress on the seal and housing
Solution Approach 1:
The seal material is selected to have thermal expansion properties that match both the first and second housing materials. This parameter matching reduces thermal stress on the seal during temperature variations, preventing seal failure while maintaining protection.
3Device complexity
If sensitive electronic components are exposed to humidity, then the field device can be simpler in design, but components like optocouplers and voltage references are particularly susceptible to humidity damage
Solution Approach 1:
The second compartment providing enhanced humidity protection is created only where specifically needed for sensitive components like optocouplers and voltage references. This localized approach protects critical components without requiring complete redesign of the entire housing structure.
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A field device (108) for use in an industrial process (100) includes a housing (110) having a cavity (112) formed therein. A humidity-sealed electronics module (126) has a first compartment (146) formed therein and is positioned in the cavity (112). The humidity-sealed electronics module (126) includes a seal board. The seal board separates the first compartment (146) of the humidity sealed electronics module (126) from a second compartment (130) in the housing (110). A first electrical component (124) in the first compartment (146) is mounted to the seal board and a second electrical component (122) in the second compartment (130) is electrically connected to the first electrical component (124).