3D Grounding Element in Humidity Sensor Assembly for ESD Protection
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Solution Overview
Problem
Humidity sensor assemblies are vulnerable to uncontrolled electrostatic discharges (ESD) during circuit board processing, which can damage the components and the signal processing module, particularly when mounted on a circuit board.
Innovation Solution
A humidity sensor arrangement with a three-dimensional, electrically conductive grounding element in the form of a bonding element, designed with an approximately circular base and upward taper, is integrated in the encapsulation recess, connected to a ground contact area to divert discharge currents away from the signal processing module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a humidity sensor assembly is mounted on a circuit board, then the sensor can perform humidity measurement, but uncontrolled electrostatic discharges can occur during processing that may damage the components and signal processing module
Solution Approach 1:
A bonding element serves as an intermediary discharge path between the encapsulation recess and ground. This mediator captures electrostatic discharge currents before they can reach sensitive components, providing protection without interfering with normal sensor operation. The bonding element is positioned to intercept discharge paths while maintaining electrical isolation from the measurement circuitry.
Solution Approach 2:
The bonding element is pre-positioned and connected to ground before any electrostatic discharge event can occur. This preliminary protective measure ensures that when ESD occurs, the discharge current is immediately diverted through the pre-established bonding element path, preventing damage to vulnerable components before they can be affected.
2Reliability
If a discharge element is arranged in the recess area, then discharge currents can be dissipated, but the structural integrity and sealing of the encapsulation may be compromised
Solution Approach 1:
The bonding element extends in the vertical dimension from the encapsulation recess downward to the ground connection, creating a three-dimensional discharge path. This vertical arrangement allows the discharge element to function effectively without compromising the horizontal sealing integrity of the encapsulation recess, as the bonding element is positioned to intercept discharge currents while maintaining the encapsulation's protective barrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage to the signal processing module by diverting discharge currents through the grounding element to ground, ensuring rapid voltage dissipation and protecting sensitive areas from capacitive coupling effects.
Implementation Method 1
uncontrolled electrostatic discharges (ESD) can occur during further processing of the board
Implementation Method 2
at least one electrically conductive grounding element is arranged in the area of the recess and is designed as a three-dimensional bonding element
Implementation Method 3
a capacitive humidity sensor is mounted on which an integrated signal processing module is arranged
Implementation Method 4
a dielectric measuring layer is arranged between the base electrode and the top electrode, which has a capacitance that depends on the humidity
Implementation Method 5
The bonding element and a gas-permeable protective layer are arranged in the recess above the humidity sensor
Data Source
Figure 1a~1c
Figure 2~3
Figure 4
AI summary
The present invention relates to a humidity sensor arrangement with an integrated signal processing module and at least one capacitive humidity sensor arranged on the signal processing module. An encapsulation partially surrounds the signal processing module and has a recess in the area of the humidity sensor. Furthermore, at least one electrically conductive discharge element is provided, which is arranged in the area of the recess. The discharge element is designed as a three-dimensional bonding element (Fig. 2).