Humidity Sensor Leak Detection for Wafer Chuck Coolant

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Solution Overview

Problem

Traditional methods for detecting leaks in coolant used for semiconductor wafer processing are not responsive enough, leading to wastage of wafers due to thermal stress-induced cracks in the wafer chuck, which cause coolant leaks during heating and cooling cycles.

Innovation Solution

A device and method that utilize a humidity sensor to measure relative humidity at the outlet of a dry wafer processing chamber, triggering a shutdown when a change above a threshold is detected, indicating a leak in deionized water coolant, thereby preventing further processing and reducing scrap wafers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional leak detection techniques are used, then the system is simple to implement, but the detection responsiveness is insufficient leading to wafer scrap

Engineering Contradiction:
Improveleak detection responsivenessVSAvoiddetection system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces traditional mechanical or pressure-based leak detection methods with a humidity sensing system. The humidity sensor detects water vapor in the exhaust gas, providing responsive electrical signal-based detection that avoids the lag of mechanical systems while maintaining implementation simplicity through standard sensor integration.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces humidity as an intermediary parameter to detect coolant leaks. Instead of directly detecting liquid coolant or pressure changes, the system measures water vapor concentration in the exhaust gas, which serves as an indirect but highly responsive indicator of leaks, enabling early detection before significant wafer damage occurs.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If continuous monitoring is implemented to improve detection accuracy, then leak detection precision improves, but energy consumption increases

Engineering Contradiction:
Improveleak detection accuracyVSAvoidenergy consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The patent implements periodic sampling of humidity levels rather than truly continuous monitoring. The controller periodically reads the humidity sensor and compares against threshold values, achieving high detection accuracy through frequent sampling while consuming minimal energy compared to constant high-rate monitoring. This allows precise leak detection while maintaining low power consumption suitable for process control systems.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables early and accurate detection of coolant leaks, minimizing material loss by instantly shutting down the processing when a leak is detected, improving reliability and reducing costs associated with scrapped wafers.

Implementation Method 1

a humidity sensor configured to measure relative humidity (RH) at an outlet of the dry wafer processing chamber

Methodology Applied
Scientific EffectHumidity measurement: Hygrometer

Implementation Method 2

cooling the wafer chuck during a cooling phase of the processing

Methodology Applied
Scientific EffectHeat absorption: Heat Exchanger

Data Source

PatentUS10395955B2Method and system for detecting a coolant leak in a dry process chamber wafer chuck
Publication Date: 2019.08.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US10395955B2 patent drawing
  • US10395955B2 patent drawing
  • US10395955B2 patent drawing

AI summary

Device and method of configuring a device to process a wafer is disclosed. The device includes a wafer chuck configured to mount the wafer, a dry wafer processing chamber configured to enclose the wafer chuck, a humidity sensor configured to measure relative humidity (RH) at an outlet of the dry wafer processing chamber, a humidity controller coupled to the humidity sensor, the humidity controller being configured to detect a change in RH above a threshold, and a process chamber controller coupled to the humidity controller. The change is triggered by a leakage in deionized water used as a coolant for cooling the wafer chuck and the wafer during the processing. The process chamber controller is configured to trigger a shutdown of the processing of the wafer in response to the leakage.