Multilayer PCB Signal Routing for Head-Up Display Heat Management
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Solution Overview
Problem
Existing head-up display devices face challenges in improving display quality and reducing the size of circuit boards due to increased complexity and heat management issues, particularly when using DMDs as display elements, while also requiring precise control of luminance and pixel control signals.
Innovation Solution
A display device design featuring a multilayer circuit board with dedicated wiring for high-speed pixel control signals and lower-speed setting signals, separate circuit boards for illumination and display control units to manage heat, and integrated light source units with temperature and intensity detection for precise luminance adjustment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the display element and display control unit are mounted on the same circuit board, then the wiring complexity is reduced, but the heat management becomes more difficult
Solution Approach 1:
The patent divides the system into two separate circuit boards: a first circuit board for mounting the display element and a second circuit board for mounting the display control unit and illumination control unit. This segmentation isolates heat-generating components on the second board from the temperature-sensitive display element on the first board, improving heat management while maintaining wiring efficiency through dedicated connection paths.
2Manufacturing precision
If high-speed pixel control signals are transmitted through the circuit board, then the display quality is improved, but the circuit board size increases
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by utilizing via holes that connect different layers of the multilayer circuit board. High-speed pixel control signals are routed through internal layers and via holes rather than surface traces, enabling high-quality signal transmission while maintaining a compact board footprint by exploiting the vertical dimension of the multilayer structure.
3Temperature
If separate circuit boards are used for illumination and display control units, then the heat management is improved, but the device complexity increases
Solution Approach 1:
The patent combines the display control unit and illumination control unit on the same second circuit board, merging their functions into a single substrate. This integration reduces the total number of circuit boards from three (separate boards for display element, display control, and illumination control) to two, simplifying the overall device structure while still isolating heat-generating components from the display element.
Data Source
AI summary
A display device includes: an illumination unit having a light source unit capable of emitting light; an illumination control unit controlling the illumination unit; a display element capable of forming an image with illumination light from the illumination unit; a display control unit controlling the display element; a control unit controlling the display control unit and the illumination control unit based on a video signal; and a first circuit board on which the display element and the display control unit are mounted. When the display element and the display control unit are mounted on the surface of the first circuit board, a first signal for controlling pixels of the display element is arranged only on the front surface of the first circuit board, while a main portion of a second signal for setting control regarding the pixels is arranged on the rear surface of the first circuit board.