High-Voltage Cascade PCB Layout for Compact Dielectric Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High voltage cascades require significant installation space, which is a constraint in applications like x-ray tubes in medical installations where compact design is essential.
Innovation Solution
The diode circuits of the cascade half stages are arranged on separate first additional circuit boards oriented orthogonally to a main board, with capacitor circuits positioned next to these boards, forming a zig-zag arrangement that reduces spatial requirements while maintaining high dielectric strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If high voltage cascades are designed with traditional layouts, then they can generate the required high voltage, but they require large installation space
Solution Approach 1:
The patent applies dimensional change by arranging circuit boards in three-dimensional space rather than traditional planar layouts. Specifically, circuit boards are positioned at different heights and angles, with some boards extending vertically and others horizontally, creating a compact 3D structure that reduces the horizontal footprint while maintaining adequate dielectric spacing between high-voltage components
Solution Approach 2:
The patent implements nesting by placing smaller circuit boards and components within the spatial envelope of larger structural elements. Circuit boards are mounted on support structures that utilize the vertical space above and below the main housing plane, effectively nesting components within each other's spatial boundaries to minimize overall installation area
2Area of stationary object
If circuit boards are arranged compactly to reduce space, then installation area decreases, but dielectric strength may be compromised
Solution Approach 1:
The patent applies local quality by providing enhanced dielectric protection specifically where high-voltage stress is greatest. Insulating materials and spacing are concentrated in critical regions between adjacent circuit boards and high-voltage terminals, while less critical areas use minimal spacing. This localized approach maintains dielectric strength where needed without unnecessarily increasing overall dimensions
Solution Approach 2:
The patent introduces intermediary insulating structures between adjacent circuit boards to maintain dielectric strength. These intermediary elements include insulating barriers, spacing elements, and dielectric materials positioned between high-voltage components on different boards, allowing compact arrangement while preventing dielectric breakdown
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a compact layout with improved dielectric strength and operational safety, enabling efficient high voltage generation in a small form factor suitable for mobile medical equipment.
Implementation Method 1
cascade half stages (3), which have respective stage inputs (4), respective stage outputs (5) and between them a respective capacitor circuit (6) and a respective diode circuit (7)
Implementation Method 2
cascade half stages (3), which have respective stage inputs (4), respective stage outputs (5) and between them a respective capacitor circuit (6) and a respective diode circuit (7)
Data Source
AI summary
Stage outputs of a respective cascade half stage of the high voltage cascade are connected to stage inputs of the respective next cascade half stage of the high voltage cascade. Diode circuits are arranged on first additional circuit boards, which are connected electrically and mechanically to a main board of the high voltage cascade. The first additional circuit boards are oriented orthogonally to the main board and follow on sequentially from one another corresponding to the electrical sequence of the cascade half stages. Capacitor circuits of the cascade half stages are arranged to the side next to the first additional circuit boards on the main board, are arranged corresponding to the electrical sequence of the cascade half stages, and alternate on sides of the first additional circuit boards.