HV Converter EMI Reduction via Segmented Copper Pads
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Solution Overview
Problem
High voltage applications using conventional DMOS devices face challenges in minimizing electromagnetic interference (EMI) noise while maintaining thermal dissipation, as large copper pad areas required for cooling increase EMI noise and occupy excessive space, making it difficult to reduce device size while ensuring safety.
Innovation Solution
The implementation of a DMOS package with a lead frame, insulation material, and V-shaped grooves, along with an island-type lead frame and a large source pad area to facilitate cooling, reduces EMI noise by minimizing the drain lead area and incorporating an island-type lead frame with raised portions for improved thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large copper pad area is used for cooling the DMOS device, then thermal dissipation is improved, but electromagnetic interference (EMI) noise increases
Solution Approach 1:
The patent divides the copper pad area into two distinct sections: a large source pad area for thermal dissipation and a small drain pad area to minimize EMI. This segmentation allows each pad to be optimized for its specific function without compromising the other.
Solution Approach 2:
Different regions of the PCB are assigned different copper pad areas based on their functional requirements. The source pad has a large area optimized for heat dissipation, while the drain pad has a small area optimized for reducing EMI noise, applying local quality to different locations.
2Temperature
If a large copper pad area is used for cooling, then thermal dissipation is improved, but device size increases due to safety space requirements
Solution Approach 1:
By segmenting the copper pad area into source and drain portions with different sizes, the patent minimizes the total area occupied by high-voltage components while maintaining adequate thermal dissipation through the large source pad.
Solution Approach 2:
The patent optimizes the spatial arrangement of copper pads in the PCB layout, utilizing the two-dimensional plane efficiently to accommodate both thermal dissipation requirements and safety space constraints.
Data Source
AI summary
A high voltage (HV) converter implemented on a printed circuit board (PCB) includes a double diffused metal oxide semiconductor (DMOS) package comprising a lead frame and a main DMOS chip. The lead frame includes a gate section electrically connected to a gate electrode of the main DMOS chip, a source section electrically connected to a source electrode of the main DMOS chip and a drain section electrically connected to a drain electrode of the main DMOS chip. The PCB layout includes a large area source copper pad attached to and overlapping the source section of the DMOS package to facilitate cooling and a small area drain copper pad attached to and overlapping the drain section of the DMOS package to reduce electromagnetic interference (EMI) noise.