HV-LED Module 3D Stacked Structure
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Solution Overview
Problem
Existing HV-LED modules face limitations in light-emitting power and packaging cost, despite their advantages in cost reduction and heat dissipation.
Innovation Solution
The implementation of a 3D light-emitting structure with stacked substage LEDs, each having an independent epitaxial light-emitting structure connected in series, separated by epitaxial insulating layers, and bonded using non-conductive and metal bonding materials, with a specific electrode configuration to enhance light transmission and extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If traditional planar LED modules are used, then the structure is simple and manufacturing is easy, but the light-emitting power per unit area is limited
Solution Approach 1:
The patent transitions from a traditional planar (2D) LED module structure to a three-dimensional stacked structure where multiple sub-stage LEDs are arranged in different layers and connected in series. This vertical stacking enables significantly higher light-emitting power per unit area by utilizing the third dimension (height/depth) while maintaining a compact footprint.
Solution Approach 2:
The patent implements a nested configuration where multiple sub-stage LEDs are integrated within a compact stacked architecture. Each sub-stage LED contains multiple LED chips connected in series, and these sub-stages are further stacked vertically, creating a nested arrangement that maximizes light-emitting power density within a small volume.
2Illumination intensity
If more LED chips are added to increase light-emitting power, then the illumination intensity increases, but the packaging cost increases
Solution Approach 1:
The patent merges multiple LED chips into integrated sub-stage units, where each sub-stage contains several LED chips connected in series on a single substrate. These sub-stages are then stacked and bonded together, reducing the number of separate packaging operations compared to individually packaging each LED chip, thereby lowering overall packaging costs while achieving high light-emitting power.
Solution Approach 2:
The patent segments the overall LED module into multiple identical or modular sub-stage units. Each sub-stage is a self-contained module with a specific number of LED chips connected in series. This segmentation allows for standardized manufacturing and assembly processes, reducing complexity and cost compared to custom assembly of individual chips, while the stacked arrangement of multiple sub-stages achieves the desired high light-emitting power.
3Ease of manufacture
If stacked substage LEDs are used to increase light-emitting power, then the packaging cost is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent segments the LED module into standardized sub-stage units that can be manufactured and tested independently before final assembly. Each sub-stage is a modular component with defined electrical and optical characteristics. This segmentation simplifies the overall manufacturing process by enabling parallel production of sub-stages, easier quality control, and simplified assembly through standardized bonding interfaces, ultimately reducing packaging costs despite the three-dimensional stacked configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly increases light-emitting power per unit area, reduces packaging costs, and downsizes the high-voltage chip module, while improving light extraction efficiency and simplifying the manufacturing process.
Implementation Method 1
Each of the substage LEDs has an independent light-emitting structure... The epitaxial light-emitting structure includes an active layer
Implementation Method 2
A non-conductive bonding layer is provided between the adjacent contact surfaces of the substage LEDs in the upper part and of the substage LEDs in the lower part
Data Source
AI summary
An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.