High-Voltage Module Calibration via Solid-State Shunting
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Solution Overview
Problem
Calibrating high-voltage electronics with multiple modules connected in series poses challenges due to the need for large, expensive electromechanical switches with high dielectric strength and insulation resistance, which are cumbersome and costly to integrate.
Innovation Solution
Incorporating controllable module switches within the high-voltage electronics to selectively connect or shunt individual or multiple electronics modules to terminals, allowing for precise calibration using a single calibration standard and eliminating the need for external high-voltage switching devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electromechanical switches are used to connect high-voltage electronics to calibration standard, then high dielectric strength and insulation resistance are achieved, but device dimensions and component price increase
Solution Approach 1:
The patent replaces electromechanical switches with solid-state semiconductor switches (MOSFETs or IGBTs) that have no moving parts. These electronic switches achieve the required high dielectric strength and insulation resistance through semiconductor physics rather than mechanical contact, eliminating the need for large, complex electromechanical components while maintaining reliability in high-voltage calibration applications
Solution Approach 2:
The invention changes the operating parameters of the switching system by using semiconductor devices with controlled gate voltages to achieve high-voltage switching capability. By controlling the gate-source voltage of MOSFETs or collector-emitter voltage of IGBTs, the system can safely handle high voltages during calibration without requiring the bulky mechanical insulation structures of traditional electromechanical switches
2Power
If electromechanical switches are used for high-voltage calibration, then high current-carrying capacity is achieved, but device dimensions and cost increase
Solution Approach 1:
The patent substitutes electromechanical switches with solid-state semiconductor switches that deliver superior current-carrying capacity without increased dimensions. The semiconductor devices use electron flow control through electric fields rather than mechanical contact, enabling high power handling in compact form factors suitable for integrated calibration systems
Solution Approach 2:
The semiconductor switches are designed to perform multiple functions: high-voltage switching, current limiting, and calibration connection/disconnection. This multi-functionality consolidates what would otherwise require separate specialized components into a single integrated device, reducing overall system complexity while maintaining high current-carrying capacity
3Stress or pressure
If multiple electronics modules are connected in series for high-voltage emulation, then high voltage range is achieved, but calibration complexity increases
Solution Approach 1:
The patent segments the high-voltage calibration system into modular components, with each electronics module capable of independent calibration through individual switching control. The series-connected modules can be calibrated separately by isolating them using the solid-state switches, reducing calibration complexity compared to treating the entire high-voltage string as a single unit
Solution Approach 2:
The invention introduces dynamic switching capability that allows real-time reconfiguration of the module connections during calibration. The semiconductor switches can rapidly change the operational state of individual modules, enabling flexible calibration sequences that adapt to different measurement requirements without manual reconfiguration, thereby simplifying the overall calibration process
Data Source
AI summary
High-voltage electronics have a plurality of electronics modules connected in series between terminals of the high-voltage electronics. A system for calibrating the high-voltage electronics includes: a plurality of controllable module switches, wherein for each respective electronics module of the plurality of electronics modules, a respective controllable module switch is configured to shunt the respective electronics module by its closing. The plurality of controllable module switches are configured to be actuated such that: in a first state of the plurality of controllable module switches, no electronics modules are connected to the terminals; in a second state of the plurality of controllable module switches, one electronics module is connected to the terminals; and in a third state of the plurality of controllable module switches, multiple electronics modules are connected to the terminals.