Sensor systems and methods for HVAC systems
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Solution Overview
Problem
Traditional HVAC systems inadequately protect sensors and electrical connections from environmental degradation due to exposure to elements like humidity, salt, and dust, as existing coating methods fail to maintain a stable form factor, leading to migration and exposure of sensitive components.
Innovation Solution
A method involving the application of a high-viscosity encapsulation material to form a dome-like structure over sensors on a circuit board, ensuring targeted protection and reducing interference with fluid flow, while minimizing material usage and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional coating methods are used to protect sensors, then sensors are covered with protective material, but the coating migrates and fails to maintain stable form factor, exposing sensitive components
Solution Approach 1:
The patent changes the viscosity parameter of the encapsulation material to a high-viscosity state, which prevents the material from migrating after application. This parameter change maintains the stable form factor of the protective coating while ensuring reliable sensor protection against environmental degradation.
Solution Approach 2:
The patent uses a composite encapsulation material that combines high viscosity with protective properties. This composite material structure allows the coating to maintain its shape and position stably while providing effective protection to the sensors and electrical connections.
2Reliability
If encapsulation material is applied to protect sensors, then sensors are shielded from environmental damage, but material usage and costs increase
Solution Approach 1:
The patent applies encapsulation material locally only to the sensors and electrical connections that require protection, rather than coating the entire circuit board. This localized application reduces the quantity of encapsulation material used while maintaining effective sensor protection against environmental degradation.
Solution Approach 2:
The patent uses a high-viscosity encapsulation material that requires only partial coverage to achieve effective protection. The high viscosity ensures the material stays in place with minimal application, providing sufficient protection without excessive material usage.
3Reliability
If encapsulation material is applied over sensors, then sensors are protected from environmental conditions, but interference with fluid flow increases
Solution Approach 1:
The patent applies the encapsulation material in a localized manner that protects the sensor body while leaving the fluid flow path clear. By selectively coating only the necessary portions of the sensor, the patent minimizes interference with fluid flow while maintaining sensor protection against environmental degradation.
Solution Approach 2:
The patent creates a protective copy or shell around the sensor using encapsulation material, which shields the sensor from environmental conditions without requiring the entire sensor assembly to be covered. This selective encapsulation reduces fluid flow interference while maintaining protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields sensors and electrical connections from environmental damage, maintaining performance and reducing material usage, thus enhancing the efficiency and longevity of HVAC system components.
Implementation Method 1
A method involving the application of a high-viscosity encapsulation material to form a dome-like structure over sensors on a circuit board, ensuring targeted protection and reducing interference with fluid flow
Data Source
AI summary
A sensor assembly for a heating, ventilation, and air conditioning (HVAC) system includes a circuit board and a plurality of sensors disposed on the circuit board. The plurality of sensors is configured to detect one or more properties of an air flow directed across the circuit board and each sensor of the plurality of sensors is individually encapsulated by a respective amount of an encapsulation material.