HVDC Converter Cooling Device Corrosion Control
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Solution Overview
Problem
High-voltage direct current transmission systems experience corrosion of aluminum heat sinks due to chemical and electrical drivers, leading to deposit formation on control electrodes, which can clog cooling channels and impair semiconductor component cooling.
Innovation Solution
Incorporating a carbon dioxide-permeable line element in the cooling line system, which allows carbon dioxide from the air to dissolve in the cooling liquid, making it more acidic and reducing aluminum hydroxide formation, combined with a control electrode system to manage electrical potentials and an ion exchanger to maintain coolant purity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum heat sinks are used in the cooling line system, then heat dissipation efficiency is improved, but corrosion and deposit formation occur due to chemical and electrical drivers
Solution Approach 1:
The patent introduces control electrodes as intermediary components within the cooling liquid to manage electrical potentials. These electrodes act as mediators that prevent direct electrical corrosion between aluminum heat sinks and other metallic components by establishing controlled potential gradients, thereby reducing corrosion while maintaining heat dissipation efficiency
Solution Approach 2:
The patent changes the chemical parameter of the cooling liquid by controlling pH levels and adding specific chemicals to inhibit aluminum corrosion. By adjusting these chemical parameters, the system prevents corrosion and deposit formation on control electrodes while preserving the heat dissipation capability of aluminum heat sinks
2Reliability
If control electrodes are arranged within the cooling liquid to manage electrical potentials, then flashover prevention is improved, but deposit formation occurs on the control electrodes
Solution Approach 1:
The patent introduces flow direction control elements as intermediaries that manipulate the cooling liquid flow patterns. These elements ensure that cooling liquid flows in specific directions that reduce stagnant zones and minimize deposit accumulation on control electrodes, while the control electrodes themselves continue to provide flashover prevention by managing electrical potentials
Solution Approach 2:
The patent changes physical parameters of the cooling liquid system by controlling flow velocity, flow direction, and turbulence characteristics. By optimizing these flow parameters, the system prevents deposit formation on control electrodes through enhanced liquid circulation and reduced sedimentation, while maintaining the electrodes' electrical potential control function
3Temperature
If cooling liquid flows through the cooling line system to dissipate heat, then cooling efficiency is improved, but clogging occurs due to detached deposits forming particles
Solution Approach 1:
The patent applies preliminary protective measures by introducing corrosion inhibitors and pH control mechanisms before significant deposit formation occurs. Flow direction control elements are also positioned upstream to prevent particle accumulation before it can lead to clogging, thereby maintaining cooling channel patency while preserving cooling efficiency
Solution Approach 2:
The patent implements feedback mechanisms through flow direction control elements that respond to flow conditions and deposit formation tendencies. By continuously adjusting flow patterns based on system conditions, the system prevents clogging while maintaining efficient heat dissipation through optimized cooling liquid circulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deposit formation on control electrodes, reduces corrosion, and ensures reliable cooling of power semiconductor components by maintaining coolant purity and acidity, thus preventing clogging and ensuring efficient heat dissipation.
Implementation Method 1
The cooling line system has at least one line element which is permeable to carbon dioxide
Implementation Method 2
allows carbon dioxide from the air to dissolve in the cooling liquid, making it more acidic
Implementation Method 3
These control electrodes apply the desired electrical potential of the immediate environment to the cooling liquid in the cooling line
Implementation Method 4
an ion exchanger to maintain coolant purity
Implementation Method 5
A cooling device is usually used to dissipate the heat loss of the power semiconductor components. This cooling device has, for example, a plurality of heat sinks which are in thermal contact with the power semiconductor components
Data Source
Figure 1~2
Figure 3
AI summary
The invention relates to a cooling device (1) for a converter of a high-voltage direct current transmission system, comprising at least one heat sink (2) having a cooling channel (4), a cooling water distributor (7) which is fluidically connected to the cooling channel (4) via a heat sink supply line (8), wherein the cooling channel (4), the cooling water distributor (7) and the heat sink supply line (8) are permeated with a cooling fluid and are part of a cooling line system (5) of the cooling device (1), and with at least one control electrode (16) which is arranged at least partially within the cooling fluid, wherein the cooling line system (5) has at least one conductor element (10) which is permeable to carbon dioxide.