Power Connection Clip for HVDC Server Rack Distribution

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Solution Overview

Problem

Traditional data center server racks face challenges with power redundancy, efficiency, and space utilization due to bulky AC-DC conversion components and high conduction losses in low-voltage DC power paths, leading to costly power consumption and limited peak power support.

Innovation Solution

A server rack architecture utilizing a power connection clip to supply high voltage direct current (HVDC) power, enabling sharing of IT-usable DC power across shelves via DC-DC converters, which reduces the need for AC-DC conversion shelves, enhances power redundancy, and lowers conduction losses, allowing for scalable and flexible power distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If AC-DC conversion power shelves are used to provide power to server racks, then power redundancy is achieved, but rack space is consumed and power efficiency is reduced

Engineering Contradiction:
Improvepower redundancyVSAvoidrack space
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extracts the AC-DC conversion function from dedicated power shelves and relocates it to individual server units. Each server contains its own AC-DC converter, eliminating the need for separate AC-DC conversion power shelves and freeing up rack space while maintaining power redundancy through distributed conversion architecture

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent segments the centralized AC-DC conversion system into distributed individual converters within each server. This segmentation allows each server to independently convert power, reducing the need for bulky centralized power conversion infrastructure and improving overall power efficiency

Inventive Principle:
Principle #1Segmentation

2Power

If low-voltage DC power paths are used for power distribution, then power delivery to IT equipment is achieved, but conduction losses increase

Engineering Contradiction:
Improvepower deliveryVSAvoidconduction losses
Core Design Contradiction:
PowerVSLoss of energy

Solution Approach 1:

The patent changes the voltage parameter in the power distribution system by implementing high-voltage DC power paths instead of low-voltage DC. This parameter change reduces conduction losses while maintaining adequate power delivery to IT equipment through the use of DC-DC converters at the point of use

Inventive Principle:
Principle #35Parameter changes

3Reliability

If multiple power supply modules are installed for redundancy, then power reliability is improved, but device complexity and maintenance difficulty increase

Engineering Contradiction:
Improvepower reliabilityVSAvoidpower supply architecture
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements self-service power supply architecture where each server independently performs AC-DC conversion and houses its own power supply modules. This eliminates the need for complex centralized power management and reduces maintenance difficulty while maintaining power reliability through distributed redundancy

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS9986658B2Power connection clip for a shelf in a server rack
Publication Date: 2018.05.29 META PLATFORMS INC
  • US9986658B2 patent drawing
  • US9986658B2 patent drawing
  • US9986658B2 patent drawing

AI summary

Various embodiments include a power connection clip to electrically couple a power distribution board of an information technology (IT) equipment shelf to a plurality of power rails/buses in a server rack. The power connection clip can include a clip body having an inner portion and an outer portion, a shelf coupler, and an electrical conductor pair. The outer portion can include at least two clip fins separated from a central stump to form at least two cavities. The shelf coupler can couple the clip body to the IT equipment shelf. The electrical conductor pair can sandwich at least the inner portion of the clip body. The electrical conductor pair is adapted to carry high-voltage direct current (HVDC) voltage. The cavities can be covered with electrical conductors. The electrical conductors in the cavities can be adapted to carry IT-usable direct current (DC) voltage.