HVPS Parallel Layout for Substrate Miniaturization

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing high voltage power supply (HVPS) circuits in image forming apparatuses suffer from inefficiencies due to inadequate separation between output terminals, leading to electromagnetic interference, overshoot, and instability, which results in a larger substrate size and potential damage to the apparatus.

Innovation Solution

The HVPS components are arranged in a parallel layout on the substrate, with transformers and output terminals disposed along the edges, maximizing separation and minimizing electromagnetic effects, allowing for a smaller substrate size and improved efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If output terminals are disposed closely adjacent to high voltage output controllers to reduce substrate size, then the substrate size is reduced, but electromagnetic interference and instability occur due to insufficient separation

Engineering Contradiction:
Improvesubstrate sizeVSAvoidhigh voltage output stability
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent transitions from a traditional linear or clustered arrangement of components to a parallel linear arrangement along the substrate edge. This dimensional reorganization allows components to be distributed along one dimension (the edge) while maintaining adequate separation distances, thereby reducing electromagnetic interference without significantly increasing the overall substrate area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the substrate into distinct sections with clear functional zones. High voltage output controllers are positioned in one region while output terminals are disposed in separate regions along the edge, creating spatial segmentation that reduces electromagnetic coupling and interference between components.

Inventive Principle:
Principle #1Segmentation

2Ease of operation

If signal lines are disposed in a complicated manner to connect components, then component connectivity is achieved, but electromagnetic effects occur between components

Engineering Contradiction:
Improvecomponent connectivityVSAvoidelectromagnetic interference
Core Design Contradiction:
Ease of operationVSObject-generated harmful factors

Solution Approach 1:

The patent simplifies signal line routing by arranging components in a linear parallel configuration along the substrate edge. This geometric arrangement naturally reduces the complexity of interconnections and minimizes the crossing and overlapping of signal lines, thereby reducing electromagnetic interference while maintaining full component connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If separation distance between output terminals is increased to prevent electric arc and overshoot, then reliability is improved, but substrate size becomes larger

Engineering Contradiction:
Improveprotection against electric arc and overshootVSAvoidsubstrate size
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent distributes output terminals along the edge of the substrate in a linear arrangement, utilizing the perimeter space efficiently. This allows adequate separation distances between terminals to prevent electric arcs and overshoot while keeping the overall substrate area compact, as the terminals are arranged along one dimension rather than requiring a larger two-dimensional space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This arrangement reduces electromagnetic interference, prevents damage, and enables a more compact design by maintaining sufficient separation between high voltage output controllers and terminals, enhancing the reliability and miniaturization of the HVPS.

Implementation Method 1

first and second plurality of transformers disposed on the substrate outside of the first and second high voltage controllers to transform the output signal provided from the first and second high voltage output controllers

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Data Source

PatentUS8884466B2High voltage power supply
Publication Date: 2014.11.11 HEWLETT PACKARD DEVELOPMENT COMPANY LP
  • US8884466B2 patent drawing
  • US8884466B2 patent drawing
  • US8884466B2 patent drawing

AI summary

A high voltage power supply (HVPS) including first and second high voltage output controllers controlling output of a high voltage output signal; and a plurality of transformers transforming an output signal provided from the first and second high voltage output controller, disposed outside of the first and second high voltage controllers on the substrate, wherein output terminals in the secondary sides of the plurality of transformers are disposed along the edge of the substrate. Therefore, the volume of a system can be minimized by arranging circuits in each component for high voltage output in parallel, and spark and discharge can be reduced by minimizing interference between the primary sides and the secondary sides of the components for high voltage output, thereby preventing damage to a product.