Hybrid 3D Printing of Electronic Circuits
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Solution Overview
Problem
Current additive manufacturing techniques for electronic circuits face limitations such as poor conductivity, resolution, and design freedom, particularly in producing three-dimensional forms and high-power electronics, while also generating chemical waste and requiring complex processes.
Innovation Solution
A hybrid 3D printing method using a printing device with a first printhead for printing conductive molten metal and a second printhead for printing non-conductive material, allowing for the direct manufacturing of electronic circuits with improved conductivity, resolution, and design freedom, and reducing waste and process complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional subtractive manufacturing methods are used for printed circuit boards, then manufacturing precision and reliability are improved, but device complexity and loss of time increase due to multiple process steps
Solution Approach 1:
The patent combines multiple separate manufacturing operations (drilling, plating, soldering, circuit tracing) into a single additive manufacturing process. The hybrid 3D printer integrates conductive material deposition and non-conductive structure printing in one unified system, eliminating the need for sequential subtractive processes and reducing overall device complexity.
Solution Approach 2:
The additive manufacturing device performs multiple functions simultaneously: it deposits conductive materials to create circuits, builds non-conductive structural components, drills holes, applies plating, and solderes components all through a single multi-functional printing system, replacing multiple dedicated manufacturing machines.
2Manufacturing precision
If conventional subtractive manufacturing methods are used for printed circuit boards, then manufacturing precision is improved, but loss of time increases due to long design-to-product time
Solution Approach 1:
The system performs preliminary actions by pre-heating and preparing conductive materials and non-conductive structures simultaneously before the actual printing process begins. The additive manufacturing device loads and prepares multiple materials in advance, enabling immediate production start and reducing overall design-to-product time.
Solution Approach 2:
The additive manufacturing process maintains continuous useful action by depositing conductive and non-conductive materials in an uninterrupted sequential manner within a single build process. Unlike conventional methods that require stopping between drilling, plating, and circuit creation steps, the 3D printing process continuously adds materials layer by layer without interruption.
3Manufacturing precision
If conventional subtractive manufacturing methods are used for printed circuit boards, then manufacturing precision is improved, but loss of substance increases due to chemical waste
Solution Approach 1:
The invention extracts and eliminates the harmful chemical processes from conventional PCB manufacturing. By replacing wet etching, chemical plating, and solvent-based solder mask applications with additive material deposition, the system removes the source of chemical waste generation while maintaining manufacturing precision through controlled material placement.
Solution Approach 2:
The patent converts the traditionally harmful subtractive approach into a beneficial additive process. Instead of removing materials through chemical etching that generates waste, the system adds only the necessary conductive and non-conductive materials in precise locations, transforming waste generation into material efficiency and environmental benefit.
4Ease of manufacture
If additive manufacturing is used for electronic circuits, then ease of manufacture and adaptability are improved, but manufacturing precision deteriorates due to limitations in multi-material printing
Solution Approach 1:
The system segments the printing process into distinct operational phases: first depositing conductive materials to create circuit traces, then adding non-conductive structural components. This segmentation allows each material type to be optimized for its specific printing requirements while maintaining overall manufacturing precision through coordinated multi-material deposition.
Solution Approach 2:
The additive manufacturing device dynamically changes printing parameters such as temperature, deposition rate, and material composition based on the specific requirements of conductive versus non-conductive materials. By adjusting these parameters during the printing process, the system maintains high manufacturing precision across different material types while preserving the ease of manufacture inherent in additive processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves higher conductivity and mechanical stability of printed circuit boards, reduces turnaround times and costs, and enables the production of complex three-dimensional electronic circuits with reduced environmental impact.
Implementation Method 1
a heater configured to melt a conductive metal provided in bulk form
Implementation Method 2
a first printhead configured for printing conductive elements from a conductive molten metal
Implementation Method 3
a second printhead configured for printing a non-conductive structure from a dielectric material
Data Source
Figure 1~2
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AI summary
The invention relates to a method of additive manufacturing of an electronic circuit. The method comprises the steps of providing a printing device comprising a build plate; a first printhead configured for printing a conductive molten metal and a second printhead configured for printing a non-conductive material. The method further comprises printing the electronic circuit by printing conductive elements from the conductive molten metal using the first printhead and printing a non-conductive structure using the second printhead of the printing device. In a further aspect, the invention relates to a printing device for the additive manufacturing of an electronic circuit. The printing device comprises: a build plate, a first printhead configured for printing conductive elements from a conductive molten metal and a second printhead configured for printing a non-conductive structure from a dielectric material.