Hybrid Additive Manufacturing of Electromechanical Assemblies
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Solution Overview
Problem
Current additive manufacturing techniques fail to produce high-quality electrical interconnections, computational circuits, and actuators in combination with mechanical elements in an integrated electromechanical component, with limitations in material compatibility, conductivity, and scalability, leading to inferior electrical performance and inability to integrate diverse materials for complex systems.
Innovation Solution
A hybrid approach combining 3D printing and placement of modules from a library of modules with both electrical and mechanical functionality, using methods like Inkjet, FDM, and Stereolithography, to create electromechanical assemblies with high-performance electrical interconnections and mechanical elements, allowing for scalable and modular fabrication of complex systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor fabrication techniques are used, then high electrical conductivity and carrier mobility are achieved, but integration with mechanical elements in a single additive manufacturing process is not possible
Solution Approach 1:
The patent combines semiconductor fabrication techniques with additive manufacturing processes to create a unified system that can fabricate both electrical circuits and mechanical elements in the same component, eliminating the need for separate manufacturing processes and assembly steps
Solution Approach 2:
The invention uses composite materials that exhibit both electrical conductivity and mechanical properties, enabling the fabrication of electromechanical assemblies with integrated functionality from a single material system
2Adaptability or versatility
If printed electronics techniques are used to create electrical circuits, then integration with 3D printed mechanical parts is achieved, but electrical conductivity and carrier mobility are dramatically reduced
Solution Approach 1:
The patent modifies the parameters of printed electronics materials and processes to improve carrier mobility and electrical conductivity while maintaining compatibility with additive manufacturing, achieving a balance between integration capability and electrical performance
Solution Approach 2:
The invention replaces traditional mechanical assembly processes with integrated additive manufacturing, substituting the mechanical joining of separate electrical and mechanical components with a unified fabrication process that creates electromechanical assemblies in situ
3Ease of manufacture
If low-temperature processing is used to maintain material compatibility, then process compatibility with other materials is improved, but electrical conductivity of deposited materials is reduced
Solution Approach 1:
The patent develops composite materials that maintain electrical conductivity at low processing temperatures, combining conductive fillers with polymer matrices to achieve both process compatibility and electrical performance
Solution Approach 2:
The invention applies local quality enhancement by concentrating conductive materials in specific regions where electrical performance is critical, while using lower-cost, temperature-compatible materials in other regions of the assembly
4Reliability
If high-resolution conventional semiconductor fabrication is used, then electrical performance is improved, but feature size is reduced by three orders of magnitude making integration with additive manufacturing difficult
Solution Approach 1:
The patent transitions from planar 2D semiconductor fabrication to 3D additive manufacturing, utilizing the third dimension to achieve electrical interconnections and circuit integration without being constrained by conventional feature size limitations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the fabrication of high-quality electromechanical assemblies with electrical and mechanical properties comparable to conventional printed circuit boards, overcoming material and process limitations, and allowing for diverse and complex integrated systems with improved performance and scalability.
Implementation Method 1
A first device deposits material into a plurality of stacked regions, with each successive region positioned on top of the previous region. The plurality of stacked regions forms a base region portion including one or more void elements.
Implementation Method 2
A second device positions module components into the void elements. The module components are generic, prefabricated components that vary in electrical functionality and/or mechanical functionality.
Implementation Method 3
In certain embodiments, a fusion device applies heat in the form of a laser beam in order to fuse the module components to one another. It is also contemplated the fusion device may be used to fuse the module components to a region portion.
Implementation Method 4
A second plurality of stacked regions forms a top region portion that encapsulates all or a portion of the module components while forming another void element. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created.
Data Source
AI summary
A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated.