Hybrid Airflow Management for Data Center Cooling Efficiency

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Solution Overview

Problem

Modern data centers face inefficiencies in cooling systems due to the use of single air sources and recirculated cooling air, which can be costly and ineffective for diverse IT equipment, and natural fresh air quality may damage electronics, necessitating a flexible and resilient cooling approach.

Innovation Solution

A hybrid and modularized airflow management system that incorporates a top layer with drop ceiling air plenums and fan coils for fresh air intake and hot air exhaust, and a bottom layer with server racks using both air and liquid cooling components, allowing for flexible air distribution and recirculation of cooling fluids and air, integrating multiple air sources for efficient cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If recirculated cooling air is used, then cooling efficiency is improved, but air quality deteriorates and may damage electronics

Engineering Contradiction:
Improvecooling efficiencyVSAvoidair quality
Core Design Contradiction:
Loss of energyVSObject-affected harmful factors

Solution Approach 1:

The air handling system is segmented into multiple independent air sources (fresh air intake, recirculated air, and liquid-cooled air) that can be selectively combined. Each air source is processed separately through dedicated cooling channels, allowing the system to segment the air flow paths and recombine them based on cooling requirements and air quality considerations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the data center receive different air compositions tailored to local cooling needs. The system provides localized air quality control by adjusting the proportion of fresh air versus recirculated air in specific zones, ensuring that sensitive equipment receives higher quality air while maintaining overall cooling efficiency.

Inventive Principle:
Principle #3Local quality

2Device complexity

If a single air source is used for cooling, then device complexity is reduced, but adaptability to different IT equipment deteriorates

Engineering Contradiction:
Improvecooling system structureVSAvoidcooling effectiveness for different equipment
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The cooling system is designed with multi-functionality to handle diverse IT equipment requirements. It can simultaneously provide air cooling and liquid cooling, adjust air composition ratios, and adapt to varying cooling loads across different equipment types, making a single system capable of serving multiple cooling needs.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system incorporates dynamic control mechanisms that allow real-time adjustment of air flow rates, cooling fluid temperatures, and air composition ratios based on the thermal loads and cooling requirements of different IT equipment. This dynamic adaptability enables the system to optimize cooling effectiveness for various equipment configurations.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If frequent upgrading of cooling systems is performed, then cooling needs are met, but capital cost increases

Engineering Contradiction:
Improvecooling capabilityVSAvoidsystem upgrade frequency
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The cooling system is divided into modular, independently upgradeable components including air handling units, liquid cooling systems, and control systems. This segmentation allows incremental upgrades of specific modules without requiring complete system replacement, reducing capital expenditure and upgrade frequency.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system incorporates dynamic and adjustable components that can adapt to changing cooling requirements through software control and parameter adjustment rather than hardware replacement. This reduces the need for frequent physical upgrades and extends system lifecycle.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces cooling costs and capital expenditures by enhancing cooling efficiency, supports diverse IT equipment, and ensures effective air distribution based on load and temperature, enabling efficient cooling of high-density IT clusters and upgrading existing infrastructure.

Implementation Method 1

The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 2

One or more servers in the bottom layer can include an air cooling component and a liquid cooling component

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

integrating multiple air sources for efficient cooling

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS11445638B2System and method for managing airflow in a data center
Publication Date: 2022.09.13 BAIDU USA LLC
  • US11445638B2 patent drawing
  • US11445638B2 patent drawing
  • US11445638B2 patent drawing

AI summary

Described herein is an airflow management system and method. The system includes a top layer and a bottom layer, and each of the layers has a dedicated air flow management and hardware system that are operated independently. The top layer is a drop ceiling air plenum, and can store fan coils arranged in a hot aisle containment fashion or a cold hair containment fashion. The top layer receives fresh air from its own air source, and exhausts hot air through its own exhaust. The bottom layer can include server racks arranged in a hot aisle containment fashion or a cold aisle containment fashion. One or more servers in the bottom layer can include an air cooling component and a liquid cooling component, and receive cooling liquid from the top layer and receives cooling air from its own air source.