Hybrid Assembly Encapsulation with Balancing Pressure
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Solution Overview
Problem
The encapsulation process for hybrid assemblies of electronic components can induce stress and strain concentrations along the substrate, leading to delamination of attachment interfaces.
Innovation Solution
A fluid medium is supplied to a trench on the opposing side of the substrate during encapsulation, maintaining a balancing pressure to support the hybrid assembly and alleviate stress and strain concentrations, using a mold assembly with a molding cavity and trench to evenly distribute pressure across the substrate's varying contour.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulation material is injected over the substrate during the encapsulation process, then the electronic components and attachment interfaces are protected and encapsulated, but stress and strain concentrations are induced along the hybrid substrate causing delamination of attachment interfaces
Solution Approach 1:
A support structure is introduced beneath the substrate to provide counterbalancing support during encapsulation. This support structure compensates for the stress and strain induced by the encapsulation material injection, preventing delamination of attachment interfaces while maintaining the protective encapsulation function.
Solution Approach 2:
A fluid medium is introduced as an intermediary between the support structure and the substrate. This fluid medium transmits the balancing pressure uniformly across the substrate surface, effectively distributing the stress from encapsulation material injection and preventing concentration of forces that would cause delamination.
2Reliability
If the substrate is supported uniformly during encapsulation, then delamination is prevented, but additional components (support structure, fluid medium) are introduced into the system
Solution Approach 1:
A fluid medium (gas or liquid) is used to transmit support pressure uniformly across the substrate during encapsulation. This hydraulic/pneumatic approach simplifies the support mechanism by using fluid pressure distribution rather than complex mechanical support structures, reducing system complexity while maintaining reliable attachment interface support.
Solution Approach 2:
The pressure of the fluid medium is dynamically adjusted during the encapsulation process to match the stress profile of the incoming encapsulation material. By changing the fluid pressure parameter in real-time, the system provides optimal support throughout the encapsulation process without requiring overly complex mechanical intervention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the likelihood of delamination by uniformly supporting the substrate during encapsulation, ensuring a stable attachment interface and improving the reliability of the hybrid assembly.
Implementation Method 1
a balancing pressure is maintained by the medium within the trench to support the hybrid assembly during the encapsulation process
Data Source
AI summary
During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.