Hybrid Attenuator for Quantum Circuits

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Solution Overview

Problem

Existing microwave attenuators for quantum computing are either purely resistive or dispersive, leading to thermalization issues, signal distortions, and inadequate frequency-dependent attenuation, which can raise temperatures and generate unwanted radiation, affecting the reliability of quantum circuits.

Innovation Solution

A hybrid microwave attenuator circuit combining resistive and dispersive components in a series configuration, including lowpass, high-pass, and bandpass filters, to provide frequency-dependent attenuation and improve thermalization, reducing noise and signal reflections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If purely resistive attenuators are used, then thermalization is improved, but temperature increases and unwanted radiation is generated

Engineering Contradiction:
ImprovethermalizationVSAvoidtemperature
Core Design Contradiction:
Stability of the object's compositionVSTemperature

Solution Approach 1:

The attenuator is divided into multiple resistive elements (first, second, third resistive elements) arranged in a T-configuration, where each element contributes to attenuation while distributing thermal effects. This segmentation allows better thermal management compared to a single resistive element, reducing the temperature increase and unwanted radiation generation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different parts of the attenuator have different properties: the T-configuration provides specific impedance matching characteristics while the resistive elements provide attenuation. The patent optimizes the arrangement and values of these elements to achieve frequency-dependent attenuation while managing thermal effects locally in different parts of the circuit.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If purely dispersive attenuators are used, then frequency-dependent attenuation is improved, but signal distortions and reflections increase

Engineering Contradiction:
Improvefrequency-dependent attenuationVSAvoidsignal quality
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The patent combines dispersive elements (inductors and capacitors forming filters) with resistive elements in a hybrid T-configuration attenuator. This merging allows the circuit to achieve both frequency-dependent attenuation characteristics and signal fidelity by leveraging the complementary strengths of dispersive and resistive components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The attenuator uses a composite structure combining different types of circuit elements (resistors, inductors, capacitors) to create a hybrid circuit that exhibits both dispersive and resistive characteristics. This composite approach enables frequency-selective attenuation while maintaining signal quality through proper impedance matching and reflection minimization.

Inventive Principle:
Principle #40Composite materials

3Power

If standard resistive attenuators are used, then attenuation is provided, but thermal and electrical resistance issues arise

Engineering Contradiction:
ImproveattenuationVSAvoidthermal and electrical resistance
Core Design Contradiction:
PowerVSObject-affected harmful factors

Solution Approach 1:

The patent creates a dynamic frequency response through the T-configuration with inductive and capacitive elements, where the attenuation characteristic varies with frequency. This dynamic behavior allows the circuit to provide effective attenuation at target frequencies while presenting different impedance characteristics at other frequencies, reducing thermal and electrical resistance issues.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the electrical parameters (impedance, attenuation) by varying frequency through the dispersive-resistive hybrid design. By optimizing the values of resistive, inductive, and capacitive elements, the circuit achieves frequency-dependent attenuation that minimizes thermal effects and electrical resistance problems at operating frequencies.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The hybrid attenuator effectively attenuates microwave signals across various frequency ranges, minimizing thermal and electrical resistance issues, and reduces signal distortions, thereby enhancing the reliability and cooling efficiency of quantum circuits.

Implementation Method 1

a dispersive component configured to attenuate a second plurality of frequencies within a frequency range by reflecting off portions of the input signal at those frequencies

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

The illustrative embodiments provide dispersive-resistive hybrid attenuator for quantum microwave circuits

Methodology Applied
Scientific EffectInterference: Interference

Implementation Method 3

a resistive component configured to attenuate a plurality of frequencies in an input signal

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS11164101B2Dispersive-resistive hybrid attenuator for quantum microwave circuits
Publication Date: 2021.11.02 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US11164101B2 patent drawing
  • US11164101B2 patent drawing
  • US11164101B2 patent drawing

AI summary

A resistive component in a hybrid microwave attenuator circuit is configured to attenuate a plurality of frequencies in an input signal. The hybrid microwave attenuator circuit is further configured with a dispersive component to attenuate a second plurality of frequencies within a frequency range by reflecting off portions of the input signal at those frequencies that are within the frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another in the hybrid microwave attenuator circuit.