Hybrid BBUL and Laminated Core Assembly via Electroless Plating
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Solution Overview
Problem
Current methods for assembling semiconductive device substrates face challenges in creating efficient, integrated structures that combine bumpless build-up layers (BBUL) and laminated cores, particularly in achieving reliable electrical connections and structural integrity for advanced packaging applications.
Innovation Solution
The integration of a BBUL structure with a laminated-core structure is achieved through a process involving the formation of plated-through holes (PTHs) using electroless copper plating, reinforcement plating, and semi-additive processing, along with the use of multiple BBUL films and a laminated core interface to form an integral electrical connection, enabling efficient assembly and interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional assembly methods are used to combine BBUL and laminated core structures, then manufacturing simplicity is maintained, but electrical connectivity and structural integrity are insufficient
Solution Approach 1:
The patent merges the BBUL structure and laminated core structure into an integral hybrid assembly where the two structures are permanently bonded together through plated-through holes. The plating process creates continuous conductive paths that electrically and mechanically connect the BBUL and laminated core, forming a unified structure that cannot be separated, thereby ensuring reliable electrical connectivity while maintaining manufacturing simplicity.
Solution Approach 2:
The patent applies preliminary action by forming plated-through holes and applying electroless copper plating before final assembly. The plating process pre-establishes conductive pathways and bonding interfaces within the hybrid structure, ensuring that electrical connections are created in advance before the structures are permanently joined, which simplifies the overall manufacturing process while guaranteeing reliable connectivity.
2Reliability
If advanced integration methods are used to achieve reliable electrical connections, then connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs self-service through the electroless copper plating process, which automatically deposits copper metal into the plated-through holes without requiring external power sources or complex equipment. The chemical plating solution self-activates on exposed metal surfaces and progressively fills the holes, creating conductive pathways and reinforcement structures. This self-service mechanism simplifies manufacturing by eliminating the need for electroplating equipment while ensuring uniform copper distribution and reliable structural integrity.
Solution Approach 2:
The patent utilizes parameter changes by controlling the electroless plating process conditions, including solution composition, temperature, and deposition time, to optimize copper fill characteristics. By adjusting these parameters, the process achieves complete hole filling with appropriate copper thickness and grain structure, ensuring both electrical connectivity and mechanical strength without requiring complex multi-step manufacturing procedures.
3Reliability
If multiple processing steps are used to form plated-through holes and reinforcement plating, then electrical connections are enhanced, but manufacturing throughput is reduced
Solution Approach 1:
The patent implements continuity of useful action by using an electroless plating process that continuously deposits copper metal throughout the plated-through holes without interruption. The chemical reaction proceeds uniformly across all exposed surfaces simultaneously, filling multiple holes in parallel without requiring sequential processing. This continuous action maintains high manufacturing throughput while ensuring complete and reliable electrical connections in all interconnect locations.
Solution Approach 2:
The patent replaces mechanical or electrochemical plating systems with an electroless chemical plating process. Instead of using external power sources, mechanical drilling followed by electroplating, or complex multi-step procedures, the invention uses a self-propagating chemical reduction reaction that automatically fills the holes with copper. This substitution eliminates complex equipment requirements and enables batch processing of multiple structures simultaneously, thereby maintaining high productivity while achieving reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a robust, efficient assembly method that enhances electrical connectivity and structural integrity, suitable for advanced packaging applications such as package-on-package (POP) and dual-core systems, while reducing warpage issues and improving manufacturing throughput.
Implementation Method 1
The integration of a BBUL structure with a laminated-core structure is achieved through a process involving the formation of plated-through holes (PTHs) using electroless copper plating
Data Source
AI summary
A structure includes a hybrid substrate for supporting a semiconductive device that includes a bumpless build-up layer in which the semiconductive device is embedded and a laminated-core structure. The bumpless build-up layer and the laminated-core structure are rendered an integral apparatus by a reinforcement plating that connects to a plated through hole in the laminated-core structure and to a subsequent bond pad of the bumpless build-up layer structure.