Hybrid Bonded Package Structure With Buffer-Layer TSV Integration
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Solution Overview
Problem
Existing semiconductor package structures and fabrication methods have limitations in terms of integration, yield, quality, and reliability, particularly in new packaging technologies like package on package (POP).
Innovation Solution
The proposed solution involves packaging a first die with a semiconductor structure into a second die, where the semiconductor structure includes a device over a substrate and a conductive plug. The substrate is thinned using a buffer layer to improve polishing uniformity, and through substrate via (TSV) structures are formed to connect the conductive plug. This process enhances the yield, quality, and reliability of the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is thinned directly without a buffer layer, then the processing is simpler, but the polishing uniformity deteriorates
Solution Approach 1:
A buffer layer is introduced as an intermediary between the substrate and the polishing process. This buffer layer serves as a mediator that enables uniform polishing by providing a consistent surface for the polishing head to contact, while also protecting the underlying substrate from direct mechanical stress during the thinning process.
Solution Approach 2:
The buffer layer is formed in advance before the thinning process begins. This preliminary action prepares the surface in advance to ensure that subsequent polishing operations will achieve uniform results, preventing polishing defects rather than correcting them after the fact.
2Reliability
If conventional packaging methods are used, then the process is simpler, but the integration and reliability deteriorate
Solution Approach 1:
The invention employs a nested structure where a first package structure is integrated within or alongside a second package structure. This nesting approach allows multiple functional units to be combined in a compact arrangement, improving overall system reliability while managing the complexity through hierarchical organization of components.
Solution Approach 2:
Multiple package structures are merged into a single integrated assembly. The first and second package structures are combined through direct bonding or interconnection, creating a unified package that achieves higher reliability through redundancy and integrated functionality, while the merging process itself manages the complexity by creating a cohesive structure.
3Reliability
If TSV structures are not formed, then the manufacturing process is simpler, but the electrical connection reliability deteriorates
Solution Approach 1:
TSV structures are formed in advance during the substrate processing stage, before final package assembly. This preliminary formation of through-substrate vias ensures that electrical connection pathways are established early, allowing for proper alignment and bonding, thereby improving electrical connection reliability without adding significant complexity to the overall manufacturing flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described method improves the yield, quality, and reliability of the package structure by ensuring uniform polishing and effective connection of conductive plugs through TSV structures, addressing the limitations of existing technologies.
Implementation Method 1
A planarization process is performed on a portion of the buffer layer and a portion of the substrate to form a thinned substrate
Implementation Method 2
through substrate via (TSV) structures are formed to connect the conductive plug
Data Source
AI summary
A package structure and a method for forming the same are provided. The package structure includes a first package structure and a second package structure. The first package structure includes a first device formed over a first substrate. The first device includes a first conductive plug connected to a through substrate via (TSV) structure formed in the first substrate. A buffer layer surrounds the first substrate. A first bonding layer is formed over the first substrate and the buffer layer. The second package structure includes a second device formed over a second substrate. A second bonding layer is formed over the second device. A hybrid bonding structure is between the first package structure and the second package structure by bonding the first bonding layer to the second bonding layer.