Hybrid-Bonded Strain Gauge Interface for Precise Substrate Strain
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Solution Overview
Problem
Existing strain gauge sensors are not effectively integrated at the hybrid bonding interface between device and carrier substrates, limiting their ability to measure strain accurately in semiconductor structures.
Innovation Solution
A strain gauge sensor is embedded at the hybrid bonding interface between a device substrate and a carrier substrate, utilizing a meandering metal foil pattern within a flexible dielectric region, connected to metal wires, to measure strain through the piezoresistive effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a strain gauge sensor is integrated at the hybrid bonding interface, then strain measurement accuracy is improved, but device complexity increases
Solution Approach 1:
The strain gauge sensor is merged with the carrier substrate by embedding it during carrier substrate formation, so that the sensor becomes an integral part of the substrate structure rather than a separate component. This integration eliminates the need for additional assembly steps and reduces overall device complexity while maintaining measurement accuracy.
Solution Approach 2:
The strain gauge sensor is embedded in the carrier substrate during the carrier substrate formation process, before the hybrid bonding interface is created. This preliminary integration ensures that the sensor is already in position and functional when the final device is assembled, avoiding later integration complexity.
2Reliability
If a strain gauge sensor is embedded at the hybrid bonding interface, then strain detection reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The strain gauge sensor is embedded in the carrier substrate during the carrier substrate formation process, which is a preliminary step that occurs before hybrid bonding. This allows the sensor to be integrated into a controlled manufacturing environment where precision can be maintained, rather than requiring high precision during the final bonding process.
Solution Approach 2:
The patent specifies that the carrier substrate includes a flexible dielectric region with a metal foil strain gauge sensor, allowing the sensor to be embedded in a material state that facilitates precise integration. The flexible dielectric region can be deposited and patterned with controlled precision before final assembly.
3Reliability
If metal wires extend entirely through the device substrate, then electrical connection reliability is improved, but device complexity increases
Solution Approach 1:
The metal wires serve multiple functions: they provide electrical connections for the strain gauge sensor, structural support for the device substrate, and serve as bonding interfaces for the hybrid bonding process. By making the metal wires multi-functional, the patent reduces the need for separate components and decreases overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise measurement of strain at the hybrid bonding interface, enhancing the accuracy and reliability of strain detection in semiconductor structures.
Implementation Method 1
The strain gauge sensor leverages the piezoresistive effect where the resistance of conductive materials change in response to mechanical strain
Data Source
AI summary
A structure including an in-situ strain gauge sensor is provided. The in-situ strain gauge sensor is formed at a hybrid bonding interface between a carrier substrate and a device substrate. The strain gauge sensor leverages the piezoresistive effect where the resistance of conductive materials change in response to mechanical strain. The voltage output can be modeled to understand strain where resistance will change based on the applied strain on the structure that contains the in-situ strain gauge sensor.