Hybrid Bonding Pressure Sequencing to Prevent Interface Bubbles
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Solution Overview
Problem
The hybrid bonding process between semiconductor chips and package substrates often results in bubbles caused by air or particles, which deteriorate the electrical connection reliability between the two components.
Innovation Solution
A hybrid bonding apparatus is designed with a central pushing module, edge pushing modules, and a bonding tool, which applies central and edge pressures to the semiconductor chip to ensure uniform bonding without trapping bubbles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If uniform pressure is applied across the entire semiconductor chip during bonding, then bonding efficiency is improved, but bubbles caused by air or particles may be trapped between the chip and substrate, deteriorating electrical connection reliability
Solution Approach 1:
The bonding apparatus divides the pressing operation into multiple segments: a central pressing unit applies pressure to the central region of the semiconductor chip, while at least two edge pressing units apply pressure to edge regions. This segmentation allows different areas to be pressed in a controlled sequence, preventing bubble entrapment while maintaining bonding efficiency.
Solution Approach 2:
The central pressing unit performs preliminary pressing action on the central portion of the semiconductor chip before the edge pressing units act on the edge regions. This preliminary action expels air and particles from the bonding interface in advance, preventing bubble formation during subsequent edge bonding operations.
2Reliability
If pressure is applied from the center outward, then bubble entrapment is prevented improving electrical connection reliability, but the bonding process complexity increases due to multiple pressing modules
Solution Approach 1:
The bonding apparatus is divided into a central pressing unit and at least two edge pressing units, allowing independent control of pressing sequences. This segmentation enables the center-outward pressure application method that prevents bubble entrapment while managing system complexity through modular design.
Solution Approach 2:
The bonding apparatus integrates multiple pressing functions into a single device: the central pressing unit handles central region bonding, while edge pressing units handle edge region bonding. This multi-functionality achieves reliable bubble-free bonding without requiring multiple separate processing steps or devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves electrical connection reliability by ensuring that no bubbles are trapped between the semiconductor chip and the package substrate, thereby enhancing the bonding process.
Implementation Method 1
The central pushing module may primarily apply a central pressure to a central portion of a semiconductor chip toward a package substrate
Implementation Method 2
The at least two edge pushing modules may secondarily apply an edge pressure to edge portions of the semiconductor chip toward the package substrate
Data Source
AI summary
A hybrid bonding apparatus may include a central pushing module, at least two edge pushing modules and a bonding tool. The central pushing module may apply a central pressure to a central portion of a semiconductor chip toward a package substrate. The at least two edge pushing modules may apply an edge pressure to edge portions of the semiconductor chip toward the package substrate. The bonding tool may transfer the central pressure and the edge pressure to the semiconductor chip. Thus, a hybrid bonding process for bonding the semiconductor chip to the package substrate may be progressed from the central portion of the semiconductor chip toward the edge portions of the semiconductor chip. As a result, a bubble caused by air or a particle may not be captured between the semiconductor chip and the package substrate to improve electrical connection reliability between the semiconductor chip and the package substrate.