Hybrid Bonding Flow With Integrated Cleaning and Plasma Activation
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Solution Overview
Problem
The existing hybrid bonding processes for attaching dies to substrates with metal surface features are complex, increasing maintenance, time, and defectivity risk due to additional preparation processes that expose substrates to environments where particulates can be deposited.
Innovation Solution
An integrated cluster hybrid bonding tool with optimized processing flows that utilize a multi-chamber system, including radiation, wet clean, and plasma activation processes, to enhance bonding performance while reducing defectivity and increasing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If complex preparation processes are used to increase bond strength, then bonding attraction is improved, but process complexity and defectivity risk increase
Solution Approach 1:
The patent employs an inert atmosphere environment within the bonding chamber to perform preparation and bonding processes simultaneously. This eliminates the need for separate preparation chambers while maintaining clean conditions that prevent contamination and oxidation, thus improving bonding attraction without increasing process complexity
Solution Approach 2:
The patent merges multiple preparation steps (cleaning, activation, adhesive removal) and the bonding process into a single integrated bonding chamber. This consolidation reduces the number of chambers required, simplifies the overall process flow, and maintains bonding strength by performing all steps in a controlled inert environment
2Strength
If multiple process chambers are used for preparation, then bonding attraction is improved, but maintenance requirements increase
Solution Approach 1:
The patent combines multiple preparation functions (wet cleaning, plasma activation, adhesive weakening) and bonding into a single chamber system. This reduces the total number of chambers from multiple separate units to one integrated chamber, thereby reducing maintenance requirements while maintaining the necessary bonding attraction through combined process steps
3Strength
If additional preparation processes are performed, then bonding attraction is improved, but processing time increases
Solution Approach 1:
The patent enables continuous processing by performing preparation steps (cleaning, activation) and bonding in sequence within the same chamber without breaking vacuum or exposing substrates to external environments. This continuous action in an inert atmosphere reduces total preparation time while maintaining bonding attraction
Solution Approach 2:
By merging preparation and bonding into a single integrated process flow within one chamber, the patent eliminates time losses associated with transferring substrates between chambers and waiting for environmental adjustments, thus reducing preparation time while maintaining bonding quality
4Strength
If substrates are exposed to additional environments, then bonding attraction is improved, but defectivity risk increases
Solution Approach 1:
The patent maintains a continuous inert atmosphere environment throughout all preparation and bonding steps within the bonding chamber. This controlled environment prevents particulate deposition and contamination that would occur during transfers to and from external environments, thus reducing defectivity risk while maintaining bonding attraction
Solution Approach 2:
By combining all preparation and bonding steps within a single chamber that maintains a controlled inert environment, the patent eliminates the need for substrates to be exposed to external environments during processing. This reduces particulate contamination risk while achieving the necessary bonding attraction through integrated process steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized processing flows reduce defectivity risk and increase bonding throughput by controlling the bonding process in a controlled environment, minimizing contamination and oxidation, and enhancing bonding strength through cleaner surfaces and controlled plasma activation.
Implementation Method 1
performing a radiation process on a component substrate with a plurality of dies to weaken an adhesive bonding of the plurality of dies from a surface of the component substrate
Implementation Method 2
performing a plasma activation process on the substrate
Data Source
AI summary
A process flow for bonding a die to a substrate incorporates defectivity risk management and yield promotion by reducing flow complexity. In some embodiments, the process flow may include a radiation process on a component substrate to weaken an adhesive bonding of dies from a surface of the component substrate, a first wet clean process on the component substrate after the radiation process to clean die bonding surfaces, eject and pick processes after performing the first wet clean process to remove dies from the component substrate for bonding to a substrate, a plasma activation process on the substrate, a second wet clean process after the plasma activation process on the substrate to clean a substrate bonding surface of the substrate, and a hybrid bonding process to bond die bonding surfaces of the dies to the substrate bonding surface of the substrate.