Hybrid Bonding Self-Assembly with Parallel Die Alignment
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Solution Overview
Problem
Current hybrid bonding equipment struggles to achieve high throughput due to the need for precision alignment, which is challenging with existing sequential water dispensing methods, limiting the ability to simultaneously place multiple dies on a wafer.
Innovation Solution
The development of a self-assembly tool that provides simultaneous liquid dispensing onto multiple bonding sites on a wafer, combined with environmental control for humidity and evaporation, allowing for precise and controlled water volumes at each site, enabling simultaneous die placement and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single nozzle is used to dispense water sequentially onto each bonding site, then sufficient water volume is ensured at each site, but throughput is significantly reduced due to step-by-step processing
Solution Approach 1:
The single nozzle is divided into multiple nozzles arranged in an array, with each nozzle corresponding to a specific bonding site. This allows simultaneous water dispensing at multiple sites while maintaining precise volume control through individual nozzle operation. The segmentation enables parallel processing without sacrificing the precision of water volume delivery to each hydrophilic region.
Solution Approach 2:
Multiple nozzles are merged into a single integrated dispensing system that operates in coordination. The array of nozzles functions as a unified device that can dispense water simultaneously to multiple bonding sites, combining the precision of sequential dispensing with the speed of parallel processing. This merging allows the system to maintain sufficient water volume control while achieving high throughput through simultaneous operation.
2Productivity
If multiple nozzles are used to dispense water simultaneously onto multiple bonding sites, then throughput is increased, but precise control of water volume at each site becomes more difficult
Solution Approach 1:
The dispensing system is segmented into multiple independent nozzles, each capable of precise water volume control. By dividing the single nozzle function across multiple nozzles, the system can simultaneously dispense precise water volumes to multiple bonding sites, maintaining manufacturing precision while achieving high throughput through parallel operation.
Solution Approach 2:
The system controls water volume parameters individually for each nozzle in the array, allowing precise adjustment of water delivery to each bonding site. By changing and controlling parameters such as nozzle activation timing, water pressure, and flow rate for each individual nozzle, the system maintains precise water volume control while enabling simultaneous dispensing to multiple sites for high throughput.
3Manufacturing precision
If die placement is performed sequentially one-by-one, then alignment accuracy can be maintained, but throughput is significantly reduced
Solution Approach 1:
Water is dispensed onto all bonding sites simultaneously before die placement begins, preparing all sites in advance. This preliminary action allows subsequent die placement to proceed in parallel without compromising alignment accuracy, as each die finds its bonded position through the pre-prepared water menisci at all sites simultaneously.
Solution Approach 2:
The system employs self-alignment through hydrophobic-hydrophilic interactions, where dies automatically position themselves on the correct bonding sites via capillary forces generated by the water menisci. This self-service mechanism eliminates the need for complex active alignment systems, allowing simultaneous die placement while maintaining high alignment accuracy through passive self-positioning forces.
4Device complexity
If ambient environment self-assembly is used without humidity control, then process simplicity is maintained, but evaporation limits the process to sequential placement
Solution Approach 1:
The system uses a controlled humidity environment that acts as an inert atmosphere for the water dispensing and die placement process. By maintaining elevated humidity levels, evaporation is suppressed and the water menisci remain stable for extended periods, enabling simultaneous die placement without requiring complex real-time humidity control during the actual bonding operation. The controlled environment protects against harmful evaporation while allowing parallel processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases throughput by allowing simultaneous die placement and alignment, while maintaining precise control over the bonding process, thereby improving alignment accuracy and reducing costs.
Implementation Method 1
the wafers and dies are patterned to create hydrophobic regions surrounding hydrophilic bonding sites
Implementation Method 2
water droplets being dispensed on the bonding sites on the wafer and confined by the surrounding hydrophobic region
Implementation Method 3
A fast rate of evaporation in a low-humidity environment may limit the self-assembly to process to a sequential (one-by-one) die placement
Implementation Method 4
environmental control for humidity and evaporation, allowing for precise and controlled water volumes at each site
Data Source
AI summary
A system that includes a self-assembly module and a bonding module. The self-assembly module has a liquid dispensing unit, with an applicator and a reservoir for a liquid, that dispenses the liquid onto a wafer, a wafer support, an environmental control unit, a die and wafer transport mechanism, and a processor. A method for performing the hybrid bonding includes providing a wafer, patterning the wafer to form a hydrophobic surface with a plurality of hydrophilic regions, disposing the wafer on the wafer support in the self-assembly module of the hybrid bonding system, dispensing the liquid simultaneously or in batches on the plurality of hydrophilic regions on the wafer, positioning dies on the plurality of hydrophilic regions on the wafer, controlling the humidity and bonding the dies to the wafer using a hybrid bonding process.