Hybrid Bonding Die Pairing for Wafer Overlay Registration
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the misalignment of dies/wafers during hybrid bonding, leading to registration mismatches and defects in circuits, which affect performance and yield, especially as device geometries shrink and tolerance for overlay errors becomes smaller.
Innovation Solution
A method and apparatus using a feedback control system with a decision-making algorithm to distribute top dies based on overlay registration, employing a smart die bonder with AI to optimize alignment and reduce overlay errors, enhancing yield through precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional die placement methods are used during hybrid bonding, then the bonding process can be completed, but registration mismatches and misalignment defects occur leading to reduced yield
Solution Approach 1:
The system performs preliminary actions by measuring overlay registration values of all dies before the bonding process, calculating optimal pairings in advance, and creating a detailed placement map that guides the die-to-die bonding process. This preliminary characterization and planning eliminates registration mismatches during actual bonding, resolving the contradiction between precision and yield.
2Manufacturing precision
If overlay registration values are measured and used for die pairing, then alignment precision is improved, but process complexity increases
Solution Approach 1:
The system implements feedback by measuring actual overlay registration values of dies, using these measurements to calculate optimal die pairings, and then executing bonding based on these optimized pairings. This closed-loop feedback approach systematically manages the complexity by transforming uncontrolled variability into controlled, data-driven decisions, resolving the contradiction between precision improvement and process complexity.
3Reliability
If strict overlay registration control is implemented, then circuit defect rate is reduced, but measurement and processing time increases
Solution Approach 1:
The system performs preliminary measurements of overlay registration values and calculates optimal die pairings before the bonding process. By completing these time-consuming measurements and calculations in advance, the system ensures high reliability through strict registration control while minimizing the time impact on the actual bonding production flow.
Data Source
AI summary
A method of hybrid bonding includes accessing first dies sourced from a first wafer and second dies sourced from one or more second wafers. First overlay registration values (ORVs) of the first dies and second ORVs of the second dies are measured. A die pairing process is executed that matches the first dies with the second dies to form paired dies based on the first ORVs and the second ORVs. A hybrid bonding process is executed to bond the paired dies.