Hybrid Bonding Interconnects Using Laser and Thermal Compression
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Solution Overview
Problem
Conventional semiconductor packaging methods result in high costs, decreased reliability, and large package sizes, leading to suboptimal performance.
Innovation Solution
The use of a laser-assisted bonding (LAB) tool in conjunction with a thermal/compression bonding (TCB) tool, where a laser source applies heat through a window to bond interconnects with a substrate, and the TCB tool provides additional heat or compression to ensure secure bonding while minimizing warpage and non-wetting issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then manufacturing process is simple, but cost is high and reliability is low
Solution Approach 1:
The patent combines laser heating and thermal compression heating into a single hybrid bonding process. The laser source heats the interconnect from one side while the TCB tool heats from the opposite side, merging two heating mechanisms to achieve reliable bonding without increasing overall process complexity
Solution Approach 2:
The patent introduces a window structure as an intermediary element that allows laser beams to pass through while maintaining the bonding interface. This window enables the laser energy to reach the interconnect without interfering with the thermal compression bonding process, facilitating reliable bonding with controlled complexity
2Volume of moving object
If conventional bonding methods are used, then process is straightforward, but package size is large
Solution Approach 1:
The patent applies heating locally at the bonding interface rather than heating the entire package structure. The laser targets specifically the interconnect region while the TCB tool applies localized thermal compression, enabling compact package design without compromising bonding quality
Solution Approach 2:
The patent replaces conventional uniform thermal field bonding with a hybrid approach using laser-assisted heating. This substitution enables more precise control of the bonding zone, reducing the overall package volume while maintaining manufacturing feasibility
3Manufacturing precision
If laser heating is applied to bond interconnect, then bonding precision is improved, but warpage and non-wetting issues occur
Solution Approach 1:
The patent uses the TCB tool as a counterbalancing element that applies thermal compression from the opposite side of the laser heating. This counter-heating approach prevents warpage by balancing the thermal gradients, while the compression force ensures proper wetting and eliminates non-wetting issues
Solution Approach 2:
The patent employs a composite bonding approach combining laser heating and thermal compression in a hybrid process. This composite method leverages the precision of laser heating while using thermal compression to mitigate harmful effects, achieving high bonding precision without warpage or non-wetting
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs, enhances reliability, and achieves smaller package sizes by ensuring precise and efficient bonding of semiconductor devices, thereby improving performance.
Implementation Method 1
heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure
Implementation Method 2
applying a second heat or compression to the interconnect with the TCB tool through the electronic component
Data Source
AI summary
In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.