Integrated Hybrid Bonding Rinse Module for Oxide-Free Copper Pads
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Solution Overview
Problem
Conventional wafer-to-wafer bonding technologies face challenges in achieving high-quality bonds due to the presence of metal oxides, which lead to inferior inter-diffusion of copper atoms and visible interfaces in the bond structure, resulting in low bond quality.
Innovation Solution
An integrated hybrid bonding system that includes a plasma treatment and an integrated cleaning station for removing metal oxides using alkaline or acidic solutions and DI water, followed by a pre-bonding process in a controlled environment to ensure clean and oxide-free surfaces for hybrid bonding, enhancing bond strength through thermal annealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional wafer-to-wafer bonding is performed without integrated cleaning, then the bonding process is simpler, but metal oxides remain on surfaces causing inferior inter-diffusion and visible interfaces
Solution Approach 1:
The patent combines the cleaning station with the bonding platform into an integrated system. The cleaning station includes a chamber with spray nozzles for applying cleaning solutions, while the bonding platform positions wafers for both cleaning and subsequent bonding operations within the same system, eliminating the need for separate cleaning equipment
Solution Approach 2:
The cleaning operation is performed before bonding as a preliminary step. The system applies cleaning solutions to remove metal oxides from wafer surfaces, then proceeds to bond the cleaned surfaces immediately, ensuring high-quality bonds before any potential re-oxidation can occur
2Manufacturing precision
If metal oxides are not removed from wafer surfaces, then the bonding process is faster, but the bond structure shows visible interfaces and poor copper atom inter-diffusion
Solution Approach 1:
The cleaning station uses hydraulic or pneumatic spray nozzles to apply cleaning solutions to the wafer surfaces. The system delivers cleaning chemicals efficiently through fluid delivery mechanisms, enabling rapid removal of metal oxides without manual intervention
Solution Approach 2:
The system changes the chemical state of the wafer surface by applying alkaline or acidic cleaning solutions that react with and remove metal oxides. This chemical parameter change transforms the surface from oxide-contaminated to clean metal surface, enabling high-quality bonding
3Reliability
If an integrated cleaning station is added to the bonding platform, then bond quality improves with no visible interfaces, but the device complexity increases
Solution Approach 1:
The bonding platform is designed to perform multiple functions: it can position wafers for cleaning operations using spray nozzles, then immediately position the same wafers for bonding operations. This multi-functionality eliminates the need for separate cleaning and bonding equipment, reducing overall system complexity despite adding cleaning capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated approach results in high-quality hybrid bonds with no visible interfaces, indicating improved inter-diffusion of copper atoms and enhanced bond quality, overcoming the limitations of conventional methods by maintaining clean surfaces during the bonding process.
Implementation Method 1
performing a plasma activation on a surface of a first package component
Implementation Method 2
removing oxide regions from surfaces of metal pads of the first package component
Implementation Method 3
enhancing bond strength through thermal annealing
Data Source
AI summary
A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.