Hybrid Bonding Structure With Silver Interface for Micro-LED Alignment
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Solution Overview
Problem
Advanced display devices for augmented and mixed reality face issues such as unevenness and chip displacement during assembly, leading to display mura and poor reliability.
Innovation Solution
A hybrid bonding structure comprising a first and second dielectric layer with embedded conductors, where the conductors are bonded using a copper-silver alloy interface, and a redistribution structure for connecting light emitting and driving chips, ensuring precise alignment and improved bonding stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods are used for assembling micro-LED chips, then assembly process is simple, but chip displacement and unevenness occur leading to display mura and poor reliability
Solution Approach 1:
The bonding structure is segmented into multiple functional layers: a first dielectric layer with first conductors, a second dielectric layer with second conductors, and a bonding interface containing silver. This segmentation allows each layer to perform its specific function (electrical connection, mechanical support, bonding) independently, improving overall bonding stability and precision
Solution Approach 2:
The bonding interface is designed as a composite structure containing silver, which combines the advantages of different materials: silver provides excellent electrical conductivity and bonding strength, while the dielectric layers provide mechanical support and insulation. This composite approach resolves the contradiction by achieving both high reliability and high precision
2Reliability
If hybrid bonding structure with copper-silver alloy interface is used, then bonding stability and uniformity are improved, but device complexity increases
Solution Approach 1:
The hybrid bonding structure performs multiple functions simultaneously: the first and second conductors provide electrical connections, the dielectric layers provide mechanical support and insulation, and the silver-containing bonding interface provides both bonding and electrical conductivity. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while improving reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The hybrid bonding structure enhances display panel reliability and uniformity by minimizing chip displacement and improving bonding stability, addressing issues of display mura.
Implementation Method 1
a bonding interface between the second conductors and the first conductors is a bonding interface containing silver
Data Source
AI summary
A bonding structure, including a first dielectric layer, multiple first conductors, a second dielectric layer, and multiple second conductors, is provided. The first conductors are embedded in the first dielectric layer, the first dielectric layer is bonded with the second dielectric layer, and the second conductors are embedded in the second dielectric layer, wherein the first conductors are bonded with the second conductors, and a bonding interface between the first conductors and the second conductors is a bonding interface containing silver.