Hybrid Bonding Tool Protrusion for Void-Free Thin Die Placement
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Solution Overview
Problem
Existing methods for copper hybrid bonding between silicon dies and substrates face challenges in achieving void-free bonding, especially in environments requiring low contaminant levels, as traditional tools are unsuitable for such conditions and fail to ensure contact across the entire die surface.
Innovation Solution
A bonding tool with a protrusion that can move between retracted and extended positions is used to bend and flatten the die, ensuring initial deformation for void-free contact, and then fully retracting to allow uniform pressure across the die surface, facilitating a void-free bonding interface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional bonding tool is used to bond the die to the substrate, then the bonding process can be performed, but void-free bonding cannot be achieved in low-contaminant environments
Solution Approach 1:
The bonding tool's contact surface is segmented into multiple regions: a central protrusion region and a surrounding flat die-holding surface. This segmentation allows different zones to perform different functions - the protrusion creates initial contact and voids, while the flat surface provides uniform pressure distribution, collectively achieving void-free bonding in clean environments
Solution Approach 2:
The central protrusion acts as an intermediary element during the bonding process. It first makes contact with the die to create a controlled void, then retracts to allow the flat die-holding surface to apply uniform pressure. This intermediary mechanism enables precise control over the bonding interface quality
2Manufacturing precision
If the bonding tool applies uniform pressure across the entire die surface, then the die can contact the substrate evenly, but initial void formation cannot be controlled
Solution Approach 1:
Before applying uniform pressure across the entire die surface, the central protrusion first makes preliminary contact with the die at a specific location. This preliminary action creates a controlled void and initiates the bonding process at a defined point, ensuring subsequent uniform pressure application occurs from a known state
Solution Approach 2:
The bonding tool employs dynamic movement of the central protrusion - extending to make initial contact, then retracting to allow uniform pressure application. This dynamic adjustment of the contact geometry enables both controlled void formation and subsequent even contact across the die surface
3Reliability
If the protrusion remains in the extended position, then initial die deformation is achieved, but uniform pressure distribution across the die surface cannot be applied
Solution Approach 1:
The central protrusion dynamically changes its position from extended to retracted during the bonding process. In the extended position, it deforms the die to create initial contact and controlled voids. In the retracted position, it allows the flat die-holding surface to apply uniform pressure distribution, achieving both initial contact quality and pressure uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable void-free bonding across the entire die surface, even in low-contaminant environments, by initially deforming the die with the protrusion and then flattening it against the substrate, ensuring a uniform and effective bonding interface.
Implementation Method 1
The protrusion is located in the extended position for bending the die when the bonding tool is carrying the die
Implementation Method 2
moving the bonding tool to flatten the die against the substrate while the substrate urges the protrusion to retract from the extended position towards the retracted position
Data Source
AI summary
When locating a semiconductor die on a substrate, the die is picked up and carried with a die-holding surface of a bonding tool having a protrusion. The protrusion of the bonding tool is configured to be movable between a retracted position within the die-holding surface and an extended position protruding from the die-holding surface. When the protrusion is located in the extended position, the die is bent when the bonding tool is carrying the die. Thereafter, the bonding tool is moved to flatten the die against the substrate while the substrate urges the protrusion to retract from the extended position towards the retracted position.