Hybrid Carrier Panel Processing for Semiconductor Subpanel Manufacturing

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Solution Overview

Problem

Current semiconductor package manufacturing methods are inefficient, leading to increased costs, decreased reliability, and larger package sizes due to sequential processing of subpanels rather than parallel processing, which limits manufacturing efficiency and requires substantial investment in new equipment.

Innovation Solution

A hybrid panel method where subpanels are mounted to a carrier panel, allowing for parallel processing and efficient manufacturing without the need for new equipment, utilizing a carrier panel that provides structural support and can withstand high temperatures and chemical exposures, enabling the formation of signal redistribution structures and other processing steps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If sequential processing of subpanels is used, then manufacturing simplicity is maintained, but productivity decreases and manufacturing time increases

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidprocessing complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The manufacturing process is segmented into two distinct phases: (1) a common parallel processing phase where multiple subpanels are simultaneously processed on a carrier panel, and (2) individual post-processing phases after separation. This segmentation allows high-productivity parallel processing for common operations while maintaining simplicity for specialized individual operations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple subpanels are merged onto a single carrier panel to enable simultaneous processing. The carrier panel consolidates multiple subpanels into one处理单元, allowing parallel execution of manufacturing steps that would otherwise require separate sequential processing of individual subpanels.

Inventive Principle:

Principle #5Merging (Combining)

2Productivity

If new equipment is invested in for parallel processing, then productivity increases, but manufacturing cost increases

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidmanufacturing cost

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The carrier panel serves multiple functions: it acts as a support structure during processing, a consolidation platform for parallel manufacturing, and a transport mechanism. This multi-functionality eliminates the need for specialized expensive equipment, as existing manufacturing tools can process the carrier panel with mounted subpanels.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The carrier panel acts as an intermediary between individual subpanels and the manufacturing process. Instead of requiring multiple separate processing lines, the carrier panel mediates by holding multiple subpanels in a configuration that can be processed by standard equipment, thereby avoiding substantial investment in new parallel processing equipment.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If subpanels are processed individually, then processing precision is maintained, but manufacturing time increases

Engineering Contradiction:

Improveprocessing precisionVSAvoidmanufacturing time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

4Volume of moving object

If package size is reduced, then device integration is improved, but reliability may decrease due to crowded layouts

Engineering Contradiction:

Improvepackage sizeVSAvoiddevice reliability

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The invention transitions from planar two-dimensional packaging to three-dimensional vertical packaging by stacking multiple subpanels on top of each other on the carrier panel. This dimensional change allows compact integration while maintaining adequate spacing and access for processing, as the subpanels are arranged in the vertical dimension rather than competing for horizontal space.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11915949B2Hybrid panel method of manufacturing electronic devices and electronic devices manufactured thereby

Publication Date: 2024.02.27 AMKOR TECH PORTUGAL SA

AI summary

A hybrid panel method of (and apparatus for) manufacturing electronic devices, and electronic devices manufactured thereby. As non-limiting examples, various aspects of this disclosure provide an apparatus for manufacturing an electronic device, where the apparatus is operable to, at least, receive a panel to which a subpanel is coupled, cut around a subpanel through a layer of material, and remove such subpanel from the panel. The apparatus may also, for example, be operable to couple to an upper side of the subpanel, and remove the subpanel from the panel by, at least in part, operating to rotate the subpanel relative to the panel.