Hybrid Classical-Quantum Chip Coupling for Low-Heat Data Exchange

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Solution Overview

Problem

Current technologies face challenges in efficiently solving complex optimization and machine learning problems due to limitations in energy efficiency, heat dissipation, and computational speed, particularly when combining classical and quantum computing approaches.

Innovation Solution

The integration of classical and quantum computing processors on a single chip, utilizing superconducting materials and Reciprocal Quantum Logic (RQL), enables data exchange and shared cooling, reducing heat dissipation and energy consumption while leveraging complementary metaheuristic algorithms like thermal and quantum annealing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If classical and quantum processors are integrated on a single chip with shared cooling, then energy efficiency is improved and heat dissipation is reduced, but device complexity increases

Engineering Contradiction:
Improveenergy efficiencyVSAvoiddevice complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The patent merges classical and quantum processors onto a single chip substrate, integrating their respective circuit components and coupling components into a unified hybrid processor architecture. This consolidation enables shared cooling infrastructure and reduces overall system complexity despite the advanced functionality achieved

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The hybrid processor is designed with multi-functionality, where the same chip substrate and cooling infrastructure serve both classical and quantum processing functions. The coupling components enable bidirectional data exchange, allowing the system to perform both classical computation and quantum computation tasks within a single integrated device

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Speed

If data exchange between classical and quantum processors is enabled through coupling components, then computational speed is improved, but heat dissipation increases

Engineering Contradiction:
Improvecomputational speedVSAvoidheat dissipation
Core Design Contradiction:
SpeedVSLoss of energy

Solution Approach 1:

The coupling components are strategically positioned and designed with specific local properties to optimize data exchange between classical and quantum processors. The superconducting materials used in these coupling components enable efficient signal transmission with minimal energy loss and heat generation at the interface between the two processing types

Inventive Principle:
Principle #3Local quality

3Use of energy by moving object

If superconducting materials are used in both classical and quantum processors, then energy efficiency is improved, but manufacturing precision requirements increase

Engineering Contradiction:
Improveenergy efficiencyVSAvoidmanufacturing precision
Core Design Contradiction:
Use of energy by moving objectVSManufacturing precision

Solution Approach 1:

The patent utilizes superconducting materials that operate at specific critical temperatures, changing the operational parameters of both classical and quantum processors to function in a common cryogenic environment. This parameter alignment enables the use of superconducting materials throughout the hybrid processor, achieving low-energy operation through superconductivity while managing manufacturing challenges through coordinated material selection and process design

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves energy efficiency, reduces computational time, and enhances solution accuracy by minimizing decoherence and communication overhead, achieving substantial energy savings and improved signal fidelity.

Implementation Method 1

the quantum computing processor and the classical computing processor each include electronic components formed from a superconducting material

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Implementation Method 2

each of the quantum computing processor and the classical computing processor includes at least one Josephson junction and an inductor

Methodology Applied
Scientific EffectJosephson effect: Josephson Effect

Implementation Method 3

each of the quantum computing processor and the classical computing processor includes at least one Josephson junction and an inductor

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 4

the one or more coupling components include a superconducting wire

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Implementation Method 5

Through an annealing process in which the Hamiltonian evolves from an initial Hamiltonian into a problem Hamiltonian, the energy spectrum or the ground state of the Hamiltonian for solving the problem can be obtained

Methodology Applied
Scientific EffectAnnealing: Annealing

Data Source

PatentUS12086091B2Chips including classical and quantum computing processors
Publication Date: 2024.09.10 GOOGLE LLC
  • US12086091B2 patent drawing
  • US12086091B2 patent drawing
  • US12086091B2 patent drawing

AI summary

An apparatus includes a substrate, a classical computing processor formed on the substrate, a quantum computing processor formed on the substrate, and one or more coupling components between the classical computing processor and the quantum computing processor, the one or more coupling components being formed on the substrate and being configured to allow data exchange between the classical computing processor and the quantum computing processor.