Hybrid Chuck Dual-Circuit Wafer Temperature Control
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Solution Overview
Problem
Conventional substrate holding devices face challenges in maintaining precise and rapid temperature control for semiconductor wafers due to high pressure issues in closed cooling circuits, leading to increased risk of failure and maintenance costs.
Innovation Solution
A dual-temperature control device system using two distinct temperature control fluids, one for a lower temperature range and another for a higher temperature range, allowing for selection based on desired physical properties to achieve efficient heat transfer and pressure management, with the option of using a Peltier element for electrical temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a closed cooling circuit with a single temperature control fluid is used, then the device structure is simple, but high pressures occur at higher operating temperatures leading to increased failure risk and maintenance costs
Solution Approach 1:
The temperature control system is divided into two separate circuits: a first closed circuit for heating operations and a second open circuit for cooling operations. This segmentation allows each circuit to be optimized for its specific function, preventing the pressure buildup that occurs when a single closed circuit attempts to handle both heating and cooling across wide temperature ranges.
Solution Approach 2:
The system changes the operational parameters of the temperature control fluid based on the required temperature range. For heating, a liquid fluid circulates in a closed circuit; for cooling, a gaseous fluid flows through an open circuit. This parameter change allows the system to operate reliably across wide temperature ranges without the pressure issues that plague single-circuit systems.
2Productivity
If a single temperature control fluid is used across wide temperature ranges, then the device complexity is reduced, but the ability to achieve quick and precise temperature changes deteriorates
Solution Approach 1:
The temperature control system is segmented into two specialized circuits: a closed first circuit for efficient heating and an open second circuit for effective cooling. Each circuit uses a fluid optimized for its specific function, enabling rapid and precise temperature changes that would be difficult to achieve with a single general-purpose fluid system.
Solution Approach 2:
The system dynamically switches between different temperature control modes by activating either the first closed circuit for heating or the second open circuit for cooling. This dynamic operation allows the system to respond quickly to temperature control requirements while maintaining relatively simple individual circuit designs.
3Reliability
If pressure-resistant seals are designed into conventional devices, then the device can withstand high pressures, but the manufacturing cost and maintenance requirements increase
Solution Approach 1:
The invention extracts the pressure-generating aspect from the cooling function by using an open cooling circuit instead of a closed one. This eliminates the need for pressure-resistant seals and high-pressure components in the cooling path, significantly reducing manufacturing costs and maintenance requirements while maintaining reliable pressure control through the separate closed heating circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables faster and more precise temperature changes across a wide range (-75°C to 400°C) with reduced maintenance and operational costs, while minimizing pressure peaks and allowing for efficient heat transfer and energy savings.
Implementation Method 1
incorporating a Peltier element for efficient heating and cooling
Implementation Method 2
the first temperature control device for controlling the temperature of the main body in a first Temperature range... is temperature controlled by means of a first temperature control fluid, and the second temperature control device for temperature control of the main body in a second temperature range... is temperature-controlled by means of a second temperature control fluid
Data Source
AI summary
Device and method for regulating the temperature of a substrate, in particular of a wafer, by means of a device comprising two temperature-regulating circuits that are operated with different temperature-regulating fluids.