Hybrid Circuit Assembly Integrating IMS and PWB
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Solution Overview
Problem
Conventional DC/DC converters require separate printed wiring assemblies for high-power and low-voltage components, leading to increased manufacturing complexity and cost due to the conflicting requirements of thick conductors for power handling and thin conductors for low-voltage components.
Innovation Solution
A hybrid circuit assembly integrating a multi-layer printed wiring board (PWB) with low-voltage components and an insulated metal substrate (IMS) having high-power components, both mounted on a common metal base plate with co-planar surfaces, allowing for efficient power and data signal transmission while maintaining insulation between conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate printed wiring assemblies are used for high-power and low-voltage components, then each component type can have optimized conductor thickness, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines high-power and low-voltage circuit boards into a single hybrid circuit assembly. The high-power circuit board with thick conductors and the low-voltage circuit board with thin conductors are integrated onto one assembly, eliminating the need for separate assemblies while maintaining optimized conductor thickness for each component type. This reduces manufacturing complexity and assembly steps.
Solution Approach 2:
The patent applies different conductor thicknesses in different regions of the same circuit assembly. The high-power section uses thick conductors for low electrical resistance, while the low-voltage section uses thin conductors for high interconnection density. This local differentiation allows each component type to have optimized conductor characteristics without requiring completely separate assemblies.
2Loss of energy
If thick conductors are used for power-handling components, then electrical resistance and power losses are minimized, but the board structure becomes more complex
Solution Approach 1:
The patent implements thick conductors only in the high-power circuit board regions where power-handling components are mounted, while the low-voltage circuit board uses standard thin conductors. This localized application of thick conductors minimizes power losses in critical areas without unnecessarily complicating the entire board structure.
Solution Approach 2:
The patent divides the circuit assembly into distinct high-power and low-voltage sections, each with appropriate conductor characteristics. The high-power section is segmented off from the low-voltage section, allowing independent optimization of conductor thickness in each region without affecting the other.
3Productivity
If thin conductors are used for low-voltage components, then interconnection density is increased, but electrical resistance increases for power handling
Solution Approach 1:
The patent applies thin conductors with high interconnection density specifically in the low-voltage circuit board regions where control and data communication circuitry is located, while the high-power circuit board uses thick conductors to minimize electrical resistance. Each region's conductor characteristics are locally optimized for its specific functional requirements.
Solution Approach 2:
The patent segments the circuit assembly into high-power and low-voltage sections with distinct conductor characteristics. The low-voltage section utilizes thin conductors for high interconnection density, while the high-power section uses thick conductors for low electrical resistance, eliminating the need to compromise either requirement in a unified design.
4Reliability
If two physically separate printed wiring assemblies are used, then conflicting conductor requirements are met, but expenses and manufacturing cost increase
Solution Approach 1:
The patent merges the high-power circuit board and low-voltage circuit board into a single hybrid circuit assembly that satisfies the conflicting conductor requirements through localized conductor design. This unified structure reduces the number of separate assemblies from two to one, thereby reducing manufacturing expenses, assembly costs, and overall production complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing complexity and cost by integrating both high-power and low-voltage components onto a single assembly, minimizing thermal and electrical resistance, and enabling efficient power handling and signal transmission.
Implementation Method 1
The PWB is mounted on the metal base plate via the insulating adhesive
Implementation Method 2
highly thermally conductive printed wiring board for power-handling and high power dissipating components
Implementation Method 3
one or more wiring layers on the insulating adhesive
Data Source
AI summary
A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive.