Hybrid Circuit Board for Display Module Light Uniformity
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Solution Overview
Problem
The development of thin display modules is hindered by the high manufacturing cost of double-layer circuit boards and the restricted layout designs when using single-layer circuit boards, which fail to achieve uniform light distribution and result in periodic bright and dark band phenomena.
Innovation Solution
A display module design utilizing a circuit element with a single-layer and double-layer circuit board structure, where the conductive layers are arranged to minimize manufacturing costs and optimize light-emitting unit placement, allowing for a thinner form factor while maintaining desired light uniformity by using a composite circuit element with different quantities of conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a double-layer circuit board is used for light-emitting units layout, then the width of the light source module is reduced, but the manufacturing cost increases
Solution Approach 1:
The light source module is divided into a first light source module with a single-layer circuit board and a second light source module with a double-layer circuit board. This segmentation allows different regions to use different circuit board structures, reducing overall manufacturing cost while maintaining compactness where needed.
Solution Approach 2:
The double-layer circuit board structure is applied locally in the second light source module where space optimization is critical, while the first light source module uses the simpler single-layer structure. This local application of complex structure minimizes cost increase while achieving width reduction in specific areas.
2Ease of manufacture
If a single-layer circuit board is used, then the manufacturing cost is reduced, but the layout design for light-emitting units is restricted
Solution Approach 1:
The circuit board system is segmented into single-layer and double-layer regions, allowing the layout design to adapt to different structural capabilities. The single-layer region maintains cost efficiency while the double-layer region provides enhanced layout flexibility for series connection arrangements.
Solution Approach 2:
The invention transitions from a uniform single-layer or double-layer structure to a hybrid multi-dimensional structure where conductive layers of different quantities coexist. This dimensional variation in circuit board structure enables both cost reduction and layout flexibility simultaneously.
3Stability of the object's composition
If light-emitting units are arranged with small P value (distance between adjacent units), then light uniformity is improved, but the A value (distance from light-emitting units to viewable area) must be increased which increases module width
Solution Approach 1:
The light source module is segmented into multiple regions with different light-emitting unit arrangements. By dividing the module, the design can maintain small P values in critical areas for light uniformity while managing overall width through strategic placement of light-emitting units in different zones.
Solution Approach 2:
Different regions of the light source module have different characteristics: some regions use small P values to ensure light uniformity, while other regions are optimized for width control. This local differentiation allows simultaneous achievement of light uniformity and compact dimensions.
Data Source
AI summary
A display module includes a display panel and a light source module adjacent to the display panel. The light source module includes a circuit element and light-emitting units on the circuit element. The circuit element includes a first circuit board region and a second circuit board region adjacent to each other. The first circuit board region includes conductive layer(s) of a quantity M including a first conductive layer. The second circuit board region includes an insulating layer and conductive layers of a quantity N. The conductive layers of the quantity N include a second conductive layer and a third conductive layer. The insulating layer is between the second conductive layer and the third conductive layer. The first conductive layer of the first circuit board region is electrically connected to the third conductive layer of the second circuit board region. M and N are integers. M≥1. N>M.