Hybrid Circuit With Integral Patch Antenna and Feeder
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Solution Overview
Problem
Manufacturers face challenges in integrating a full wireless system, such as Wi-Fi and Bluetooth, into a single hybrid circuit package due to size constraints and interference issues with the antenna, which affects performance and gain.
Innovation Solution
A hybrid circuit with an integral planar patch antenna positioned above the circuit, connected via a conducting feeder, and encapsulated with a filling material to form a robust monolithic package, reducing signal attenuation and noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna is integrated into the hybrid circuit package, then the device size is reduced and functionality is combined, but the antenna performance deteriorates due to interference from the circuit and packaging
Solution Approach 1:
The antenna is segmented from the circuit board and positioned at a distance above it, allowing the antenna to function independently while maintaining integration benefits. The antenna is supported by separate support structures rather than being directly mounted on the circuit board.
Solution Approach 2:
A dielectric material is introduced as an intermediary between the antenna and the circuit board, serving as both an electrical insulator and a mechanical support. This intermediary reduces electromagnetic interference while maintaining the compact integrated structure.
2Volume of stationary object
If the antenna is placed close to the circuit, then the package size is minimized, but signal attenuation and noise increase
Solution Approach 1:
The dielectric material acts as an intermediary that electrically isolates the antenna from the circuit board, reducing signal attenuation and noise while allowing the antenna to be positioned close to the circuit for compact packaging.
Solution Approach 2:
The dielectric material provides localized electrical insulation and support precisely where needed between the antenna and circuit board, allowing other areas to be optimized for different functions while maintaining overall compactness.
3Ease of manufacture
If the antenna is mounted directly on the circuit board, then the manufacturing process is simplified, but the antenna gain is reduced due to interference
Solution Approach 1:
The dielectric material serves as a simple intermediary component that can be easily integrated into the manufacturing process while significantly improving antenna gain by reducing interference from the circuit board.
Solution Approach 2:
The dielectric material performs multiple functions simultaneously: electrical insulation, mechanical support, and interference reduction, making it a universal solution that simplifies the overall manufacturing process while improving performance.
Data Source
AI summary
A circuit with an integral antenna, including a hybrid circuit on a substrate, a patch antenna that is adapted to be positioned at a pre-selected distance above the hybrid circuit and coupled to the hybrid circuit to form a single physical unit, a feeder that electronically connects between the hybrid circuit and the patch antenna.