Hybrid Cloth TSV Substrate Manufacturing via Integrated Column Weaving
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing ceramic TSV substrates using macro methods face challenges such as high costs, poor adhesion, and potential for voids or cracking due to numerous interfaces, and issues with metal wires being dislodged or broken during the filling process with ceramic materials.
Innovation Solution
A new method involving the formation of a hybrid cloth integrated column by weaving metal wires and supportive wires, which allows for efficient and reliable fixation of metal wires and the use of ceramic or glass materials to create a 3D array of parallel metal wires, enabling the production of TSV substrates with improved adhesion and reduced defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If macro methods are used to make ceramic TSV substrates by forming multiple interfaces among ceramic coatings or matrix pieces, then TSV substrates can be produced, but adhesion is poor and voids or cracking occur
Solution Approach 1:
The invention divides the ceramic substrate into multiple layers (first ceramic layer, second ceramic layer, third ceramic layer) with metal wires embedded between them. This segmentation allows each layer to be formed and cured independently, reducing interface defects and improving adhesion compared to forming all interfaces simultaneously.
Solution Approach 2:
The invention performs preliminary actions by first forming the hybrid cloth with metal wires embedded in a first ceramic layer, then adding subsequent ceramic layers. This step-by-step approach allows each interface to be properly formed and cured before adding the next layer, preventing voids and cracking that occur when multiple interfaces are formed at once.
2Adaptability or versatility
If metal wires are fixed only at two ends by framework in macro methods, then complex 3D wire patterns can be formed, but wires are dislodged or broken during filling process
Solution Approach 1:
The invention applies local quality by embedding metal wires within the ceramic matrix at multiple locations throughout the substrate thickness, not just at the ends. The wires are surrounded by ceramic material in the first, second, and third layers, providing localized support and fixation along their entire length, preventing dislodgement or breaking during the filling process.
3Manufacturing precision
If micro-level processing technologies are used to make each via individually, then precise via positioning is achieved, but manufacture is very time consuming and expensive
Solution Approach 1:
The invention merges multiple individual via formation operations into a single macro-level process. Instead of forming each via individually through micro-level processing, the hybrid cloth with multiple metal wires is formed as a single integrated structure and then embedded into the ceramic substrate in one operation, dramatically improving productivity while maintaining precision.
4Manufacturing precision
If smaller via diameter and pitch are made in micro methods, then higher density connections are achieved, but substrate thickness is limited and substrates become easily broken
Solution Approach 1:
The invention transitions from two-dimensional via patterns in thin substrates to three-dimensional wire arrangements in thicker substrates. Metal wires extend through multiple ceramic layers in the thickness direction, enabling high-density connections without limiting substrate thickness. The wires are fixed at multiple points throughout the volume, providing mechanical reinforcement that prevents substrate breakage.
Data Source
AI summary
The disclosure describes a method for making a hybrid cloth integrated column and further making TSV substrates, which comprises the key processing steps: forming a hybrid cloth by using metal wires and supportive wires, which contains at least one 2D array of parallel metal wires in one direction; forming a column of layered structure, which contains at least a plurality of layers of hybrid cloths, wherein all the 2D arrays of parallel metal wires are fixed in the column of layered structure and are arranged into a 3D array of parallel metal wires; making all the layers of the column of layered structure into a solid entity so as to form a hybrid cloth integrated column; and slicing the hybrid cloth integrated column to make TSV substrates.