Hybrid Cold Plate Cooling for Multi-Chip Thermal Decoupling
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Solution Overview
Problem
Existing cooling systems for microelectronic devices face challenges in thermal resistance and efficiency, particularly in high-power density chips, leading to increased operational costs and reduced performance due to elevated temperatures and cumulative thermal resistance from multiple components.
Innovation Solution
An integrated cooling assembly combining liquid and air cooling methods within a device package, utilizing a cold plate with fluid channels and thermally decoupled heat sinks to reduce thermal resistance and provide targeted cooling for high and low power-density devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple thermal interface materials and heat spreaders are used to cool high-power density chips, then heat dissipation coverage is improved, but cumulative thermal resistance increases and cooling efficiency decreases
Solution Approach 1:
The patent extracts and removes intermediate thermal components (heat spreaders and multiple TIM layers) from the heat transfer path, creating a direct liquid cooling connection between the cold plate and semiconductor device. This eliminates the cumulative thermal resistance of multiple interfaces while maintaining effective heat dissipation coverage.
Solution Approach 2:
The cooling system is segmented into dedicated liquid cooling zones for high-power devices and air cooling zones for low-power devices, with each zone optimized independently. This segmentation allows direct liquid cooling contact with high-power density chips without thermal interference from other components.
2Device complexity
If a single heat sink is used for multiple devices in a package, then device complexity is reduced, but thermal coupling between devices increases causing cross-heating
Solution Approach 1:
The cooling system is divided into separate thermal zones: high-power density devices receive dedicated liquid cooling through direct cold plate contact, while low-power density devices use air cooling through heat sinks. This segmentation prevents thermal coupling and cross-heating between devices while maintaining manageable system complexity.
Solution Approach 2:
Different cooling methods are applied to different regions of the device package based on local power density requirements. High-power devices receive intensive liquid cooling, while low-power devices receive adequate air cooling, optimizing thermal management for each local region without uniform over-engineering.
3Reliability
If thermal interface materials are used between chip and heat dissipation devices, then thermal coupling is facilitated, but interfacial thermal resistance reduces heat transfer efficiency
Solution Approach 1:
The patent removes thermal interface materials from the primary heat transfer path by implementing direct contact between the cold plate and the semiconductor device backside. This extraction eliminates the thermal resistance of TIM layers while maintaining adequate thermal coupling through direct liquid cooling contact.
Solution Approach 2:
The patent uses liquid coolant flowing through channels in the cold plate to transfer heat directly from the semiconductor device. This hydraulic cooling method provides superior heat transfer efficiency compared to solid thermal interface materials, as the liquid can be pumped at high flow rates to overcome contact resistance.
4Temperature
If liquid cooling is applied to all devices in a package, then cooling performance is maximized, but device package weight and complexity increase
Solution Approach 1:
Liquid cooling is applied locally only to high-power density devices that require it, while low-power density devices use lighter air cooling through heat sinks. This selective approach maximizes cooling performance where needed while minimizing overall package weight and complexity.
Solution Approach 2:
Instead of applying liquid cooling to all devices (excessive action), the patent applies it only to the subset of high-power devices that actually need it (partial action). This avoids the unnecessary weight and complexity of liquid cooling infrastructure for low-power devices while maintaining adequate cooling for all.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves reduced thermal mass, faster cooling response, and lower operational costs by decoupling thermal solutions, minimizing cross-heating and cumulative thermal resistance, while maintaining structural integrity and assembly flexibility.
Implementation Method 1
a cold plate with fluid channels... utilizing a cold plate with fluid channels and thermally decoupled heat sinks to reduce thermal resistance
Implementation Method 2
liquid and air cooling methods... liquid coolant flowing through channels in the cold plate
Implementation Method 3
heat sinks attached to at least one second die... thermally decoupled heat sinks
Implementation Method 4
air cooling or other coolants using heat dissipation devices including heat spreaders
Data Source
AI summary
In some implementations, a cooling apparatus may include an integrated cooling assembly comprising a first die and a cold plate having first and second portions, the first portion being attached to a backside of the first die, the second portion being spaced apart from the backside of the first die to define at least one fluid channel arranged for a liquid coolant between the second portion and the backside of the first die. The cooling apparatus further includes a plurality of second dies communicatively coupled to the first die and one or more heat sinks attached to at least one second die of the plurality of second dies. The cold plate is thermally decoupled from the one or more heat sinks.